2018 Article

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Corrosion mechanism of Zn-30Sn high-temperature, lead-free solder in neutral NaCl solution

Zhenghong Wang、Chuantong Chen、Jianchun Liu、Gong Zhang、Katsuaki Suganum

Corrosion Science, 140 [1] (2018) 40-50

DOI:10.1016/j.corsci.2018.06.025

Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-based tracks at a low temperature below 100 °C

Wanli Li, Cai-Fu Li, Jinting Jiu, Minoru Ueshima, Zhi-Quan Liu and Katsuaki Suganuma

Nanoscale, 10 (2018) 5254-5263

DOI:10.1039/C7NR09225C

High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in   high-power device

Hao Zhang, Chuantong Chen, Jinting Jiu, Shijo Nagao, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics, 29 [10] (2018) 8854–8862.

DOI:10.1007/s10854-018-8903-9

Solid porous Ag–Ag interface bonding and its application in the die-attached modules

Chuantong Chen,Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics, 29 [15] (2018) 13418–13428

DOI:10.1007/s10854-018-9467-4

Low-stress design of bonding structure and its thermal shock performance (− 50 to 250 °C) in SiC/DBC power die-attached modules

Chuantong Chen, Chanyang Choe, Zheng Zhang, Dongjin Kim, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics, 29 [16] (2018) 14335–14346

DOI:10.1007/s10854-018-9568-0

 Bonding technology based on solid porous Ag for large area chip

Chuantong Chen, Seungjun Noh, Hao Zhang, Chanyang Choe, Jinting Jiu, Shijo Nagao, and Katsuaki Suganuma

Scripta Materialia, 146 [15] (2018), 123-127

DOI:10.1016/j.scriptamat.2017.11

Effect of electroplated Au layer on bonding performance of Ag pastes

Taikun Fan, Hao Zhang, Panju Shang, Caifu Li, Chuantong Chen, Jianxin Wang, Zhiquan Liu, Hao Zhang, and Katsuaki Suganuma

J. Alloys Compd., 731 [15] (2018), 1280-1287

DOI:10.1016/j.jallcom.2017.09.279

Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: microstructure, resistivity, oxidation resistance, and long-term stability

Wanli Li, Lingying Li, Yue Gao, Dawei Hu, Cai-Fu Li, Hao Zhang, Jinting Jiu, Shijo Nagao, and Katsuaki Suganuma

J. Alloys Compd., 732 [25] (2018), 240-247

DOI:10.1016/j.jallcom.2017.10.193

Thermal Stability of Silver Paste Sintering on Coated Copper and Aluminum Substrates

Chun Pei, Chuantong Chen, Guicui Fu, and Katsuaki Suganuma

J. Electron. Mater, 47 [1] (2018), 811-819

DOI:10.1007/s11664-017-5857-2

Heat-resistant die-attach with cold-rolled Ag sheet

S. J. Noh, C. Choe, C. Chen, and K. Suganuma

Appl. Phys. Express, 11 [1] (2018), 016501_1-4

DOI:10.7567/APEX.11.016501

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