2017 Article

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Effect of Sn crystallographic orientation on solder electromigration and Ni diffusion in Cu/Ni plating/Sn–0.7Cu joint at low current density

Tauya Kadoguchi, Tsubasa Sakai, Tsubasa Sei, Naoya Take, Kimihiro Yamanaka, Shijo Nagao, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics, 28 [17] (2017), 12630–12639

DOI:10.1007/s10854-017-7087-z
 

Printable and flexible copper-silver alloy electrodes with high conductivity and ultrahigh oxidation resistance

Wanli Li, Dawei Hu, Lingying Li, Cai-fu Li, Jinting Jiu, Chuantong Chen, Toshiyuki Ishina, Tohru Sugahara, and Katsuaki Suganuma

ACS Appl. Mater. Interfaces, 9 [29] (2017), 24711–24721

DOI: 10.1021/acsami.7b05308

 

Electrochemical behavior of Zn-xSn high-temperature solder alloys in 0.5 M NaCl solution

Zhenghong Wang, Chuantong Chen, Jinting Jiu, Shijo Nagao, Masaya Nogi, Hirotaka Koga, Hao Zhang, Gong Zhang, Katsuaki Suganuma

Journal of Alloys and Compounds, 16 [5] (2017), 231-239

DOI:org/10.1016/j.jallcom.2017.04.281

Enhancing Low-Temperature and Pressureless Sintering of Micron Silver Paste Based on an Ether-Type Solvent

Hao Zhang, Wanli Li, Yue Gao, Hao Zhang,  Jinting Jiu, Katsuaki Suganuma

Journal of Electronic Materials, 46 [8] (2017)5201–5208

doi:10.1007/s11664-017-5525-6

Die Bonding Performance Using Bimodal Cu Particle Paste Under Different Sintering Atmospheres

Yue Gao,Hao Zhang, Wanli Li, Jinting Jiu, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma

Journal of Electronic Materials, 46 [7] (2017), 4575–4581

DOI:10.1007/s11664-017-5464-2

Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices

Chuantong Chen, Shijo Nagao, Katsuaki Suganuma, Jinting Jiu, Tohru Sugahara, Hao Zhang, Tomohito Iwashige, Kazuhiko Sugiura and Kazuhiro Tsuruta

Acta Materialia, 129 [1] (2017), 41-51

DOI: 10.1016/j.actamat.2017.02.065

 

Modifying the valence state of molybdenum in the efficient oxide buffer layer of organic solar cells via a mild hydrogen peroxide treatment

Shuren Cong,   Afshin Hadipour,   Tohru Sugahara,   Tingting Wei,   Jinting Jiu,   Samaneh Ranjbar,   Yukiko Hirose,   Makoto Karakawa,   Shijo Nagao,   Tom Aernouts and    Katsuaki Suganuma

J. Mater. Chem. C, 5 [4] (2017), 889-895

DOI: 10.1039/C6TC04461A

Investigation of thermal transport in polymer composites with percolating networks of silver thin films by the flash diffusivity method

Sigurd R. Pettersen, Shijo Nagao, Helge Kristiansen, Susanne Helland, John Njagi, Katsuaki Suganuma, Zhiliang Zhang, and Jianying He

J. Appl. Phys., 121 [2] (2017), 025101

http://dx.doi.org/10.1063/1.4973682

 Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design

Chuantong Chen , Shijo Nagao, Hao Zhang, Jinting Jiu, Tohru Sugahara, Katsuaki Suganuma, Tomohito Iwashige, Kazuhiko Sugiura, Kazuhiro Tsuruta

Journal of Electronic Materials, 46 [2] (2017), 1576–1586

DOI:10.1007/s11664-016-5200-3

High reliable and high conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement

Wanli Li,   Hao Zhang,   Yue Gao,   Jinting Jiu,   Cai-fu Li,  Chuantong Chen,   Dawei Hu,   Yusuke Goya,   Yutao Wang,  Hirotaka Koga,   Shijo Nagao and   Katsuaki Suganuma

J. Mater. Chem. C.,  5 (2017), 1155-1164

DOI: 10.1039/C6TC04892G

Highly thermostable joint of a Cu/Ni–P plating/Sn–0.7Cu solder added with Cu balls

Takuya Kadoguchi, Naoya Take, Kimihiro Yamanaka, Shijo Nagao, and Katsuaki Suganuma

Journal of Materials Science., 52 [6] (2017), 3244–3254

Doi:10.1007/s10853-016-0613-1

Biaxially stretchable silver nanowire conductive film embedded in a taro leaf-templated PDMS surface

Chunhui Wu, Jinting Jiu, Teppei Araki, Hirotaka Koga, Tsuyoshi Sekitani, Hao Wang andKatsuaki Suganuma

Nanotechnology, 28 (2017), 01LT01

Doi: org/10.1088/0957-4484/28/1/01LT01

In situ bridging effect of Ag2O on pressureless and low-temperature sintering of micron-scale silver paste

Hao Zhang, Yue Gao, Jinting Jin, Katsuaki Suganuma

Journal of Alloys and compounds, 696 [5] (2017), 123-129

http://dx.doi.org/10.1016/j.jallcom.2016.11.225

Thermal Fatigue Behavior of Silicon-Carbide-Doped Silver Microflake Sinter Joints for Die Attachment in Silicon/Silicon Carbide Power Devices

Hao Zhang, Chuantong Chen, Shijo Nagao,Katsuaki Suganuma

Journal of Electronic Materials, 46 [2] (2017), 1055–1060

doi:10.1007/s11664-016-5069-1

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