2018 Article

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Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-based tracks at a low temperature below 100 °C

Wanli Li, Cai-Fu Li, Jinting Jiu, Minoru Ueshima, Zhi-Quan Liu and Katsuaki Suganuma

Nanoscale, 10 (2018) 5254-5263

DOI:10.1039/C7NR09225C

Bonding technology based on solid porous Ag for large area chip

Chuantong Chen, Seungjun Noh, Hao Zhang, Chanyang Choe, Jinting Jiu, Shijo Nagao, and Katsuaki Suganuma

Scripta Materialia, 146 [15] (2018), 123-127

DOI:10.1016/j.scriptamat.2017.11

Effect of electroplated Au layer on bonding performance of Ag pastes

Taikun Fan, Hao Zhang, Panju Shang, Caifu Li, Chuantong Chen, Jianxin Wang, Zhiquan Liu, Hao Zhang, and Katsuaki Suganuma

J. Alloys Compd., 731 [15] (2018), 1280-1287

DOI:10.1016/j.jallcom.2017.09.279

Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: microstructure, resistivity, oxidation resistance, and long-term stability

Wanli Li, Lingying Li, Yue Gao, Dawei Hu, Cai-Fu Li, Hao Zhang, Jinting Jiu, Shijo Nagao, and Katsuaki Suganuma

J. Alloys Compd., 732 [25] (2018), 240-247

DOI:10.1016/j.jallcom.2017.10.193

Thermal Stability of Silver Paste Sintering on Coated Copper and Aluminum Substrates

Chun Pei, Chuantong Chen, Guicui Fu, and Katsuaki Suganuma

J. Electron. Mater, 47 [1] (2018), 811-819

DOI:10.1007/s11664-017-5857-2

Heat-resistant die-attach with cold-rolled Ag sheet

S. J. Noh, C. Choe, C. Chen, and K. Suganuma

Appl. Phys. Express, 11 [1] (2018), 016501_1-4

DOI:10.7567/APEX.11.016501

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