2018 Article

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Influence of thermal exposure upon mechanical/electrical properties and
microstructure of sintered micro-porous silver

Chanyang Choe, Seungjun Noh, Chuantong Chen, Dongjin Kim, Katsuaki Suganuma

Microelectronics Reliability, 88-90 (2018) 695-700


Large-area die-attachment by silver stress migration bonding for power device applications

Seungjun Noh, Hao Zhang, Jeyun Yoem, Chuantong Chen, Caifu Li, and Katsuaki Suganuma

Microelectronics Reliability, 88-90 (2018) 701-706.


Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure

Dongjin Kim, Chuantong Chen, Aiji Suetake, Chanyang Choe, Tohru Sugahara, Shijo Nagao, Katsuaki Suganuma

Microelectronics Reliability, 88–90 (2018) 779–787

DOI: 10.1016/j.microrel.2018.07.044

Printed wire interconnection using Ag sinter paste for wide band gap power semiconductors

Seungjun Noh, Chanyang Choe, Chuantong Chen, and Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics, 29 [17] (2018) 15223–15232


Corrosion mechanism of Zn-30Sn high-temperature, lead-free solder in neutral NaCl solution

Zhenghong Wang、Chuantong Chen、Jianchun Liu、Gong Zhang、Katsuaki Suganum

Corrosion Science, 140 [1] (2018) 40-50


Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-based tracks at a low temperature below 100 °C

Wanli Li, Cai-Fu Li, Jinting Jiu, Minoru Ueshima, Zhi-Quan Liu and Katsuaki Suganuma

Nanoscale, 10 (2018) 5254-5263


High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in   high-power device

Hao Zhang, Chuantong Chen, Jinting Jiu, Shijo Nagao, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics, 29 [10] (2018) 8854–8862.


Solid porous Ag–Ag interface bonding and its application in the die-attached modules

Chuantong Chen,Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics, 29 [15] (2018) 13418–13428


Low-stress design of bonding structure and its thermal shock performance (− 50 to 250 °C) in SiC/DBC power die-attached modules

Chuantong Chen, Chanyang Choe, Zheng Zhang, Dongjin Kim, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics, 29 [16] (2018) 14335–14346


 Bonding technology based on solid porous Ag for large area chip

Chuantong Chen, Seungjun Noh, Hao Zhang, Chanyang Choe, Jinting Jiu, Shijo Nagao, and Katsuaki Suganuma

Scripta Materialia, 146 [15] (2018), 123-127


Effect of electroplated Au layer on bonding performance of Ag pastes

Taikun Fan, Hao Zhang, Panju Shang, Caifu Li, Chuantong Chen, Jianxin Wang, Zhiquan Liu, Hao Zhang, and Katsuaki Suganuma

J. Alloys Compd., 731 [15] (2018), 1280-1287


Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: microstructure, resistivity, oxidation resistance, and long-term stability

Wanli Li, Lingying Li, Yue Gao, Dawei Hu, Cai-Fu Li, Hao Zhang, Jinting Jiu, Shijo Nagao, and Katsuaki Suganuma

J. Alloys Compd., 732 [25] (2018), 240-247


Thermal Stability of Silver Paste Sintering on Coated Copper and Aluminum Substrates

Chun Pei, Chuantong Chen, Guicui Fu, and Katsuaki Suganuma

J. Electron. Mater, 47 [1] (2018), 811-819


Heat-resistant die-attach with cold-rolled Ag sheet

S. J. Noh, C. Choe, C. Chen, and K. Suganuma

Appl. Phys. Express, 11 [1] (2018), 016501_1-4


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