2001 Article

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Effect of Ag content on properties of Sn-Ag binary alloy solder,

K. Suganuma, S-H. Huh, K. Kim, H. Nakase and Y. Nakamura:
Mater. Trans. JIM, 42 (2001) 286-291.

http://www.jim.or.jp/journal/e/42/02/286.html

Effect of Ag Addition on microstructure and mechanical properties of Sn-Cu eutectic solder,

S-H. Huh, K-S. Kim and K. Suganuma:
Material.Trans. JIM, 42 (2001) 739-744.

http://www.jim.or.jp/journal/e/42/05/739.html

Advances in lead-free electronics soldering,

K. Suganuma:
Current Opinion in Solid State and Materials Science, 5[1] (2001) 555-64.

http://dx.doi.org/10.1016/S1359-0286(00)00036-X

High-resolution electron microscopy and structural optimization of C36, B36N36 and Fe@B36N36 clusters,

T. Oku and K. Suganuma:
Diamond and Related Mater., 10 (2001) 1205-1209.

http://dx.doi.org/10.1016/S0925-9635(00)00392-7

Synthesis and characterization of cobalt nanoparticles encapsulated in boronnitride nanocages,

H. Kitahara, T. Oku, T.Hirano and K. Suganuma:
Diamond and Related Mater., 10 (2001) 1210-1213.

http://dx.doi.org/10.1016/S0925-9635(00)00374-5

Synthesis of boron nitride nanotubes and nanocapsules with LaB6,

M. Kuno, T. Oku and K. Suganuma:
Diamond and Related Mater., 10 (2001) 1231-1234.

http://dx.doi.org/10.1016/S0925-9635(00)00481-7

Structural characterization of the metal/glass interface in bioactive glass coating on Ti-6Al-4V,

T. Oku, K. Suganuma, L. R. Wallenberg, A. P. Tomsia, J. M. Gomez-Vaga, and E. Saiz:
J. Mater. Sci. Medicine, 12 (2001) 413-417.

DOI 10.1023/A:1011296903316

Squeeze casting for processing advanced materials,

K. Suganuma:
Recent Research Developments in Materials Science, 2 (2001) 19-26.

ISBN 81-7736-045-0

Encapsulation of cobalt oxide nanoparticles and Ar in boron nitride nanocapsules,

M. Kuno, T. Oku and K. Suganuma:
Scripta Mater., 44 (2001) 1583-1586.

http://dx.doi.org/10.1016/S1359-6462(01)00778-3

High temperature stability of lead-free soldering interface,

K. Suganuma and C. W. Hwang:
to be published in IEEE CPMT (2002), (Proc. Electronics Goes Green 2000+, ed. By H. Reighl and H.Griese, VDE Verlag, (2000) 67-72), (2001).

The development and commercialization of lead-free soldering,

K. Suganuma:
MRS Bulletin, 26 (2001) 880-884.

DOI: http://dx.doi.org/10.1557/mrs2001.228

Atomic structure and stability of elliptical carbon onion,

H. Kitahara, T. Oku and K. Suganuma:
Eur. Phys. J. D, 16 (2001) 361-363.

DOI 10.1007/s100530170130

Formation and atomic structure of a tetrahedral carbon onion,

I. Narita, T. Oku, K. Suganuma, K. Hiraga and E. Aoyagi:
J. Mater. Chem., 11 (2001) 1761-1762.

DOI: 10.1039/B102787P

Wetting and interface integrity of Sn-Ag-Bi solder-42 alloy system,

C-W. Hwang, K. Suganuma, E. Saiz, and A. P. Tomsia:
Trans. JWRI, 30 (2001) Sp. 167-172. (Third International Conference on High Temperature Capillarity, HTC2000, Kurashiki, 19-22 November, 2000).

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