2003 Article

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Improvement of properties of Sn-Cu lead-free solder by third element alloying and its reliability for through-hole circuit assembly,

S. -H. Huh, K. -S. Kim and K. Suganuma:
Adv. In Tech. of Mat. And Mat. Proc. J., 5[1] (2003) 1-6.

Effect of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints,

K.-S. Kim, S. -H. Hwuh and K. Suganuma:
J. Alloys Compounds, 352[1-2] (2003) 226-236.

http://dx.doi.org/10.1016/S0925-8388(02)01166-0

Effect of composition cooling rate on the microstructure and tensile properties of Sn-Zn-Bi solder alloy,

Y.-S. Kim, K.-S. Kim, C.-W. Hwang and K. Suganuma:
J. Alloys Compounds, 352[1-2] (2003) 237-245.

http://dx.doi.org/10.1016/S0925-8388(02)01168-4

Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu,

K.-S. Kim, S. -H. Hwuh and K. Suganuma:
Microelectronics Reliability, 43 (2003) 259-267.

http://dx.doi.org/10.1016/S0026-2714(02)00239-1

In situ observation and simulation of solidification process in soldering SOP with Sn-Ag-Cu lead-free alloy,

K. S. Kim, M. Haga and K. Suganuma:
J. Electron. Mater., 32[12] (2003) 1483-1489.

DOI 10.1007/s11664-003-0118-y

Interfacial microstructure between Sn-3Ag-xBi alloy and Cu substrate with or without electrolytic Ni plating,

C. Hwang, J.-G. Lee, K. Suganuma and H. Mori:
J. Electron. Mater., 32[2] (2003) 52-62.

DOI 10.1007/s11664-003-0237-5

Sn-Bi共晶合金の組織及び機械的性質へ及ぼすAg添加の影響,

菅沼 克昭,酒井 泰治,金 槿銖:
エレクトロニクス実装学会誌, 6 (2003) 414-419.

Effects of fourth alloying additives on interfacial microstructure of Sn-Ag-Cu lead-free soldered joints,

K.-S. Kim, K. Suganuma, T. Shimozuki and C. G. Lee:
Mater. Sci. Forum, 439 (2003) 7-11.

DOI 10.4028/www.scientific.net/MSF.439.7

Interfaces in lead-free soldering,

C.-W. Hwang, K.-S. Kim and K. Suganuma:
J. Electron. Mater., 32[11] (2003) 1249-56.

DOI 10.1007/s11664-003-0019-0

Interface Microstructure between Fe-42Ni Alloy and Pure Sn,

C.-W. Hwang, K. Suganuma, J.-G. Lee and H. Mori:
J. Mater. Res., 18[5] (2003) 1202-1210.

DOI http://dx.doi.org/10.1557/JMR.2003.0165

Interface microstructures between Ni-P alloy plating and Sn-Ag-(Cu) lead-free solders,

C.-W. Hwang, K. Suganuma, M. Kiso and S. Hashimoto:
J. Mater. Res., 18[11] (2003) 2540-2543.

DOI http://dx.doi.org/10.1557/JMR.2003.0354

A new approach to an artificial joint based on bio-cartilage / porous β-tricalcium phosphate system,

S. Aoki, S. Yamaguchi, A. Nakahira and K. Suganuma:
J. Euro. Ceram. Soc., 23[15] (2003) 2939-2946.

http://dx.doi.org/10.1016/S0955-2219(03)00305-4

Spreading of Sn-Ag solders on Fe-Ni alloys,

E. Saiz, C.-W. Hwang, K. Suganuma and A. P. Tomsia:
Acta Mater., 51[11] (2003) 3185-3197.

http://dx.doi.org/10.1016/S1359-6454(03)00140-X

Wetting and Strength Issues at Al/α-Alumina Interfaces,

E. Saiz, A. P. Tomsia, and K. Suganuma:
J. Euro. Ceram. Soc., 23 (2003) 2787-2796.

http://dx.doi.org/10.1016/S0955-2219(03)00290-5

Effect of the joining pressure on Ag-epoxy conductive adhesive/Sn interfaces exposed to heat,

M. Yamashita and K. Suganuma:
J. Mater. Sci. Lett., 22[19] (2003) 1311-1313.

DOI 10.1023/A:1025766723541

Bioactive glass coatings for orthopedic metallic implants,

S. Lopez-Esteban, E. Saiz, S. Fujino, T. Oku, K. Suganuma and A. P. Tomsia:
J. Euro. Ceram. Soc., 23 (2003) 2921-2930.

http://dx.doi.org/10.1016/S0955-2219(03)00303-0

The Catalytic activities of nanoclusters dispersed on apatite,

J. Ichihara, K. Iteya, H. Kawaguchi, Y. Sasaki, H. Nakayama and S. Yamaguchi:
J. Ceram. Proc. Res., 4 (2003) 42-44.

Cetylpyridinium dodecatungstate on fluorapatite: efficient and reusable solid catalyst for solvent-free epoxidation,

J. Ichihara, A. Kambara, K. Iteya, E. Sugimoto, T. Shinkawa, A.Takaoka, S. Yamaguchi and Y. Sasaki:
Green Chemistry, 5 (2003) 491-493.

DOI: 10.1039/B303315E

Twin structures of rhombohedral and cubic boron nitride prepared by chemical vapor deposition method,

T. Oku, K. Hiraga, T. Matsuda, T. Hirai and M. Hirabayashi:
Diamond Relat. Mater., 12 (2003) 1138-1145.

http://dx.doi.org/10.1016/S0925-9635(02)00329-1

Effects of catalytic metals for synthesis of BN fullerene nanomaterials,

I. Narita and T. Oku:
Diamond Relat. Mater., 12 (2003) 1146-1150.

http://dx.doi.org/10.1016/S0925-9635(02)00322-9

Synthesis, argon/hydrogen storage and magnetic properties of boron nitride nanotubes and nanocapsules,

T. Oku and M. Kuno:
Diamond Relat. Mater., 12 (2003) 840-845.

http://dx.doi.org/10.1016/S0925-9635(02)00326-6

Direct observation of B84 and B156 clusters by high-resolution electron microscopy and crystallographic image processing,

T. Oku:
Sol. State Comm., 127 (2003) 689-693.

http://dx.doi.org/10.1016/S0038-1098(03)00510-6

Formation and structures of multiply-twinned nanoparticles with fivefold symmetry in chemical vapor deposited boron nitride,

T. Oku, K. Hiraga, T. Matsuda, T. Hirai and M. Hirabayashi:
Diamond Relat. Mater., 12 (2003) 1918-1926.

http://dx.doi.org/10.1016/S0925-9635(03)00188-2

Direct high-resolution electron microscopy of BN nanotubes with hexagonal zigzag network,

I. Narita and T. Oku:
Chem. Phys. Lett., 377 (2003) 354-358.

http://dx.doi.org/10.1016/S0009-2614(03)01158-8

Synthesis of boron nitride nanotubes by using NbB2, YB6 and YB6/Ni powder,

I. Narita and T. Oku:
Diamond Relat. Mater., 12 (2003) 1912-1917.

http://dx.doi.org/10.1016/S0925-9635(03)00310-8

Formation and structure of B24N24 clusters,

T. Oku, A. Nishiwaki, I. Narita and M. Gonda:
Chem. Phys. Lett., 380 (2003) 620-623.

http://dx.doi.org/10.1016/j.cplett.2003.08.096

Iron nanoparticles coated with boron nitride nanolayers synthesized by a solid phase reaction,

H. Tokoro, S. Fujii and T. Oku:
IEEE Trans. Mag., 39 (2003) 2761-2763.

DOI 10.1109/TMAG.2003.815591

First-principles study of La-B36N36 cage,

Q. Wang, Q. Sun, T. Oku and Y. Kawazoe:
Physica B, 339 (2003) 105-109.

http://dx.doi.org/10.1016/j.physb.2003.08.119

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