2007 Article

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Thermal Properties and Phase Stability of Zn-Sn and Zn-In Alloys as High Temperature Lead-Free Solder,

Jae-Ean Lee, Keun-Soo Kim, Katsuaki Suganuma, Masahiro Inoue and Goro Izuta:
Materials Transactions, Vol. 48, No. 3 (2007) 584-593.

Formation and Atomic Structures of Boron Nitride Nanotubes with Cup-Stacked and Fe Nanowire Encapsulated Structures,

Takeo Oku, Naruhiro Koi, Ichihito Narita, Katsuaki Suganuma and Masahiko Nishijima:
Materials Transactions, 48[4] (2007) , 722-729.

DOI:10.2320/matertrans.48.722

Novel method for room temperature sintering of Ag nanoparticle paste in air,

Daisuke Wakuda, Mariko Hatamura, Katsuaki Suganuma:
Chemical Physics Letters, 441 (2007), 305-308

DOI:10.1016/j.cplett.2007.05.033

Mechanical deformation-induced Sn whiskers growth on electroplated films in the advanced flexible electronic packaging,

Shih-Kang Lin, Yuhi Yorikado, Junxiang Jiang, Keun-Soo Kim, Katsuaki Suganuma: Sinn-Wen Chen, Masanobu Tsujimoto and Isamu Yanada
J. Mater. Res., 22[7] (2007), 1975-1986

DOI:10.1557/jmr.2007.0232

Microstructure development of mechanical-deformation-induced Sn whiskers,

Shih-Kang Lin, Yuhi Yorikado, Junxiang Jiang, Keun-Soo Kim, Katsuaki Suganuma, Sinn-Wen Chen, Masanobu Tsujimoto and Isamu Yanada:
J. Electron. Mater., 36[12](2007), 32-34

DOI:10.1007/s11664-007-0284-4

Studies on Solder Bump Electromigration in Cu/Sn-3Ag-0.5Cu/Cu System,

K. Yamanaka, Y. Tsukada and K. Suganuma:
Microelectronics Reliability, 47[8](2007), 1280-1287

DOI:10.1016/j.microrel.2006.09.028

Properties of low temperature Sn-Ag-Bi-In solder systems,

K.-S. Kim, T. Imanishi, K. Suganuma, M. Ueshima, and R. Kato:
Microelectronics Reliability, 47[7](2007), 1113-1119

DOI:10.1016/j.microrel.2006.06.012

Thermal stability of poly(vinylidene fluoride) films pre-annealed at various temperatures,

M. Inoue, Y. Tada, K. Suganuma, H. Ishiguro:
Polymer Degradation and Stability, 92 [10] (2007) 1833-1840

DOI:10.1016/j.polymdegradstab.2007.07.003

Solder Electromigration in Cu/In/Cu Flip-chip Joint System,

K. Yamanaka, Y. Tsukada and K. Suganuma:
J. Alloys and Compounds, 437[1-2] (2007), 186-190

DOI:10.1016/j.jallcom.2006.07.125

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