2008 Article

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Characteristics of Zn-Al-Cu Alloys for High Temperature Solder Application,

Seong-Jun Kim, Keun-Soo Kim, Sun-Sik Kim, Chung-Yun Kang and Katsuaki Suganuma:
Materials Transactions, 49[7] (2008) 1531-1536.


Oxidation Behavior of Sn-Zn Solders Under High-Temperature and High-Humidity Conditions,

J. Jiang, J. E. Lee, K. S. Kim, and K. Suganuma:
J. Alloy. Compd. 462 [1-2], (2008) 244-251.


The root causes of the “Black Pad” phenomenon and avoidance tactics,

K. Suganuma, K. S. Kim:
JOM, 60 [6] (2008) 61-65.


Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn-Zn eutectic alloy,

J. E. Lee, K. S. Kim, M. Inoue, J. Jiang and K. Suganuma:
J. Alloy. Compd., 454[1-2] (2008) 310-320.


A super-flexible sensor system for humanoid robots and related applications,

M. Inoue, Y. Kawahito, Y. Tada, T. Hondo, T. Kawasaki, K. Suganuma, H. Ishiguro:
エレクトロニクス実装学会誌, 11 (2) (2008) 136-140.

Structures and purification of boron nitride nanotubes synthesized from boron-based powders with iron particles,

N. Koi, T. Oku, M. Inoue, K. Suganuma:
J. Materials Science, 43 (8) (2008) 2955-2961.


A study on solder electromigration in Cu/In/Cu flip-chip joint system,

K. Yamanaka, Y. Tsukada, K. Suganuma:
エレクトロニクス実装学会誌, 11 (1) (2008) 60-65.

Room temperature sintering of Ag nanoparticles by drying solvent,

Daisuke Wakuda, Keun-Soo Kim, and Katsuaki Suganuma:
Scripta Materialia, 59, (2008) 649-652.


Electronic and optical properties of boron nitride nanotubes,

T. Oku, N. Koi, and K. Suganuma:
J. Phys. Chem. Sol., 69[5-6](2008), 1228-1231. May



多田 泰徳, 井上 雅博, 河崎 俊実, 川人 康, 石黒 浩, 菅沼 克昭
日本ロボット学会誌, 26[2](2008), 90-96.

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