2009 Article

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Variations in polymeric structure of ferroelectric poly (vinylidene fluoride) films during annealing at various temperatures,

M. Inoue, Y. Tada, K. Suganuma, H. Ishiguro:
J, Applied Polymer Science, 111-6, 2837-2843 (2009.6).

DOI: 10.1002/app.29323

Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates,

Seongjun Kim, Keun-Soo Kim, Katsuaki Suganuma, Goro Izuta:
Journal of Electronic Materials, 38-6, 873-883 (2009.6).


Microstructural Changes of the Ag-Epoxy ICA/Sn Interface in a High-Humidity environment,

Sun-Sik Kim, Keun-Soo Kim, Seong-Jun Kim, Katsuaki Suganuma:
Journal of Electronic Materials, 38-6, 896-901 (2009.6).


High-temperature lead-free solders: Properties and possibilities,

Katsuaki Suganuma, Seong-Jun Kim and Keun-Soo Kim:
JOM, 61[1](2009), 64-71.


Preparation of Ag nanorods with high yield by polyol process,

J.T. Jiu, K. Murai, D.-S. Kim, K.-S. Kim, K. Suganuma:
Materials Chemistry and Physics 114 (2009), 333-338.



Simplified testing method of Cu concentration in solder bath utilizing Cu dissolution,

G.Izuta, T.Tanabe and K.Suganuma:
IEEE Transactions on Components and Packaging Technologies, 32[3](2009), 138-143.

Improving the reliability of Si die-attachment with Zn-Sn-based high-temperature Pb-free solder using a TiN diffusion barrier,

Seong-jun Kim, Keun-Soo Kim, Sun-Sik Kim, Katsuaki Suganuma and Goro Izuta:
J. Electron. Mater., Accepted, DOI: 10.1007/s11664-009-0928-7


Interfacial reaction and Die attach properties of Zn-Sn High-temperature solders,

Seong-jun Kim, Keun-Soo Kim, Sun-Sik Kim, and Katsuaki Suganuma,
J. Electron. Mater., 38 [2] (2009) 266-272.



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