2010 Article

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Sn-Ag-Cu Soldering Reliability as Influenced by Process Atmosphere,

Alongheng Baated, Junxiang Jiang, Keun-Soo Kim, Katsuaki Suganuma, Sharon Huang, Benjamin Jurcik, Shigeyoshi Nozawa, and Minoru Ueshima:
IEEE Transactions on Electronics Packaging Manufacturing, 33-1, 38-43 (2010).

DOI:10.1109/TEPM.2009.2035442

Effects of reflow atmosphere and flux on Sn whisker Growth of Sn-Ag-Cu solders,

Alongheng Baated, Keun-Soo Kim, Katsuaki Suganuma, Sharon Huang, Benjamin Jurcik, Shigeyoshi Nozawa, and Minoru Ueshima:
Journal of Material Science : Materials in Electronics, 21-10, 1066-1075 (2010).

DOI10.1007/s10854-010-0099-6

Whisker Growth from an Electroplated Zinc Coating,

Alongheng Baated, Keun-Soo Kim, Katsuaki Suganuma:
Journal of Material Research, 25-11, 2175-2182 (2010).

DOI:10.1557/jmr.2010.0273

Effects of Zn-Bearing Flux on Joint Reliability and Microstructure of Sn-3.5Ag Soldering on Electroless Ni-Au Surface Finish,

Hitoshi Sakurai, Youichi Kukimoto, Seong Jun Kim, Alongheng Baated, Ki Ju Lee, Keun-Soo Kim, Seishi Kumamoto, and Katsuaki Suganuma:
Japan. Mater. Trans., 51-10, 1727-1734 (2010).

Optimization of the Mechanical Performance of Bacterial Cellulose/Poly(L-lactic) Acid Composites,

F. Quero, M. Nogi, H. Yano, K. Abdulsalami, S. M. Holmes, B. H. Sakakini, and S. J. Eichhorn:
ACS Applied Materials & Interfaces, 2, 321-330 (2010).

DOI: 10.1021/am900817f

Microstructure and mechanical properties of bacterial cellulose/chitosan porous scaffold,

T. T. Nge, M. Nogi, H. Yano, J. Sugiyama:
Cellulose, 17, 349-363 (2010).

DOI:10.1007/s10570-009-9394-x

Fibrillation of dried chitin into 10-20 nm nanofibers by a simple grinding method under acidic conditions,

S. Ifuku, M. Nogi, M. Yoshioka, M. Morimoto, H. Yano, H. Saimoto:
Carbohydrate Polymers, 81, 134-139 (2010).

Preparation of nanofibrillar carbon from chitin nanofibers,

M. Nogi, F. Kurosaki, H. Yano, M. Takano:
Carbohydrate Polymers, 81, 919-924 (2010).

DOI:10.1016/j.carbpol.2010.04.006

Effects of Zn-containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability,

Hitoshi Sakurai, Seongjun Kim, Alongheng Baated, Kiju Lee, Keun-Soo Kim, Youichi Kukimoto, Seishi Kumamoto and Katsuaki Suganuma:
Journal of Electronic Materials, 39-12, 2598-2604(2010).

DOI:10.1007/s11664-010-1344-8

Electrical resistance and microstructural changes of silver epoxy isotropic conductive adhesive joints under high humidity and heat,

S.S. Kim, K.S. Kim, K. Lee, S. Kim, K. Suganuma, H. Tanaka:
J. Electron. Mater., 40-2, 232-238 (2011.02).

DOI:10.1007/s11664-010-1421-z

Die bonding for a nitride light-emitting diode by low-temperature sintering of micrometer size silver particles,

M. Kuramoto, S. Ogawa, M. Niwa, K.S. Kim, K. Suganuma:
IEEE T. Compon. Pack. T., 33-4, 801-808 (2010. 12).

DOI:10.1109/TCAPT.2010.2064313

Ag nanoparticles paste synthesis for room temperature bonding,

D. Wakuda, K.S. Kim, K. Suganuma:
IEEE T. Compon. Pack. T., 33-2, 437-442 (2010. 6).

DOI:10.1109/TCAPT.2009.2031680

Synthesis of silver nanorods and application for die attach materials in devices,

Jinting Jiu, Keiichi Murai, Keunsoo Kim, Katsuaki Suganuma,
J. Mater. Sci.: Mater Electron, 21, 713 (2010).

DOI:10.1007/s10854-009-9983-3

錫ウィスカ成長に及ぼす端子材の影響,

金 槿銖,菅沼 克昭,寄門 雄飛,李 奇柱,アローハン,辻本 雅宣:
銅と銅合金,49, 112-115 (2010.8).

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