2012 Article

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Printed silver nanowire antennas with low signal loss in high frequency radio

Natsuki Komoda, Masaya Nogi, Katsuaki Suganuma, Kazuo Kohno, Yutaka Akiyama, Kanji Otsuka
Nanoscale, 4, 3148-3153 (2012).

DOI: 10.1039/c2nr30485f

Highly sensitive antenna using inkjet overprinting with particle-free conductive inks

Natsuki Komoda, Masaya Nogi, Katsuaki Suganuma, Kanji Otsuka
ACS Applied materials & interfaces, 4,5732–5736(2012).

DOI:10.1021/am301747p

Effect of Void Volume and Silver Loading on Strain Response of Electrical Resistance in Silver Flakes/Polyurethane Composite for Stretchable Conductors

T. Araki, T. Sugahara, M. Nogi, K. Suganuma
Japanese Journal of Applied Physics, 51 ,11PD01-5 (2012).

DOI:10.1143/JJAP.51.11PD01

Low-temperature low-pressure die attach with hybrid silver particle paste

Katsuaki Suganuma, Soichi Sakamoto, Noriko Kagami, Daisuke Wakuda, Keun-Soo Kim, Masaya Nogi
Microelectronics Reliability, 52, 375-380 (2012).

 DOI:10.1016/j.microrel.2011.07.088

Enhanced ductility and oxidation resistance of Zn through the addition of minor elements for use in wide-gap semiconductor die-bonding materials

S.W. Park, T. Sugahara, , K. S. Kim, K. Suganuma
Journal of Alloys and Compounds , 542, 236-240 (2012).

DOI:10.1016/j.jallcom.2012.07.040

Effect of crystal orientation on mechanically induced Sn whiskers on Sn–Cu plating

Yukiko Mizuguchi, Yosuke Murakami, Shigetaka Tomiya, Tadashi Asai, Tomoya Kiga, and Katsuaki Suganuma
J. Electron. Mater., 41(7), 1859-1867 (2012).

DOI: 10.1007/s11664-012-1962-4

Low-Temperature and pressureless Ag-Ag Direct Bonding for Light Emitting Diode Die-Attachment

M. Kuramoto, T. Kunimune, S. Ogawa, M. Niwa, K.S. Kim, K. Suganuma
IEEE T. Compon. Pack. T., 2-4, 548-552 (2012).

DOI:10.1109/TCPMT.2011.2180385

High-Conductivity Adhesive for Light-Emitting Diode Die-Attachment by Low-Temperature Sintering of Micrometer-Sized Ag Particles

T. Kunimune, M. Kuramoto, S. Ogawa, M. Niwa, M. Nogi, K. Suganuma
IEEE T. Compon. Pack. T., 2-6, 909-915 (2012).

DOI:10.1109/TCPMT.2012.2188292

Effects of Cu Contents in Flux on Microstructure and Joint Strength of Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish

Hitoshi Sakurai, Keun-Soo Kim, Kiju Lee, Chang-Jae Kim, Youichi Kukimoto and Katsuaki Suganuma
Microelectronics Reliability, 52-11, 2716-2722(2012).

DOI:10.1016/j.microrel.2012.05.005 

Synthesis and application of Ag nanowires via a trace salt assisted hydrothermal process

Jinting Jiu, Takehiro Tokuno, Masaya Nogi, Katsuaki Suganuma
Journal of Nanoparticle Research (2012)14:975

DOI:10.1007/s11051-012-0975-5

Ag / TiO2 core-shell nanocables prepared with a one-step polyol process

J. Jiu, M. Nogia, T. Sugahara, K. Suganuma, M. Tsujimoto, and S. Isorda
Journal of Nanoparticle Research (2012) 14:1241

DOI:10.1007/s11051-012-1241-6

Paper-immobilized Enzyme as a Green Microstructured Catalyst,

Hirotaka Koga, Takuya Kitaoka and Akira Isogai
Journal of Materials Chemistry, 22(23), 11591-11597 (2012).

DOI: 10.1039/C2JM30759F

Thermoelectric Properties and Microstructures of AgSbTe2-added p-type Pb0.16Ge0.84Te

A. Yusufu, K. Kurosaki, T. Sugahara, Ohishi, H. Muta, and S. Yamanaka
Physica Status Solidi (a) 209, 167-170 (2012).

DOI: 10.1002/pssa.201127194

Structure and Thermoelectric Properties of Ca2-xSrxFeMoO6 (0 ≤ x ≤ 0.3) double-perovskite

T. Sugahara, N. V. Nong, and M. Ohtaki
Mater. Chem. Phys. 133, 630-634 (2012).

DOI:10.1016/j.matchemphys.2012.01.032

Structure and Thermoelectric properties of Double-Perovskite Oxides : Sr2-xKxFeMoO6

T. Sugahara, T. Araki, K. Suganuma, and M. Ohtaki
J. Ceram. Soc. Japan 120, 1-6 (2012).

High-temperature thermoelectric properties of non-stoichiometric Ag1−xInTe2 with chalcopyrite Structure

A. Yusufu, K. Kurosaki, T. Sugahara, Ohishi, H. Muta, and S. Yamanaka
Materials Science and Engineering B 177, 999–1002 (2012).

DOI:10.1016/j.mseb.2012.04.025

Chalcopyrite CuGaTe2: A High-Efficiency Bulk Thermoelectric Material

Theerayuth Plirdpring, Ken Kurosaki, Atsuko Kosuga, Tristan Day, Samad Firdosy, Vilupanur Ravi, G. Jeffrey Snyder, Adul Harnwunggmoung, Tohru Sugahara, Yuji Ohishi, Hiroaki Muta, Shinsuke Yamanaka
Advanced Materials 24, 3622–3626 (2012).

DOI: 10.1002/adma.201200732

Transparent electrodes fabricated via the self-assembly of silver nanowires using a bubble template.

Takehiro Tokuno, Masaya Nogi, Jinting Jiu, Tohru Sugahara, and Katsuaki Suganuma
Langmuir, 28, 9298−9302 (2012).

DOI: 10.1021/la300961m

Strongly adhesive and flexible transparent silver nanowire conductive film fabricated with high-intensity pulsed light technique

Jinting Jiu , Masaya Nogi , Tohru Sugahara , Takehiro Tokuno , Teppei Araki , Natsuki Komoda , Katsuaki Suganuma , Hiroshi Uchida and Kenji Shinozaki
Journal of Materials Chemistry ,22 ,23561-23567(2012)

DOI: 10.1039/C2JM35545K

Absorption layers of ink vehicles for inkjet-printed lines with low electrical resistance

Changjae Kim, Masaya Nogi*, Katsuaki Suganuma, Yukie Saitou, Jun Shirakami
RSC Advances , 2, 8447-8451(2012)

DOI: 10.1039/C2RA21442C

Interfaces in Cross-Linked and Grafted Bacterial Cellulose/Poly(Lactic Acid) Resin Composites

Franck Quero,Stephen J. Eichhorn, Masaya Nogi, Hiroyuki Yano, Koon-Yang Lee, Alexander Bismarck
Journal of Polymers and the Environment , 20 , 916–925 (2012)

DOI:10.1007/s10924-012-0487-5

Hybrid transparent electrodes of silver nanowires and carbon nanotubes: a low-temperature solution process

Takehiro Tokuno, Masaya Nogi, Jinting Jiu, Katsuaki Suganuma
Nanoscale Research Letters , 7, 281 (2012)

DOI:  10.1186/1556-276X-7-281

Inkjet-printed lines with well-defined morphologies and low electrical resistance on repellent pore-structured polyimide films

Changjae Kim, Masaya Nogi*, Katsuaki Suganuma, Yo Yamato
ACS Applied Materials & Interfaces, 4 , 2168−2173 (2012)

DOI: 10.1021/am300160s

The Effective Young’s Modulus of Bacterial and Microfibrillated Cellulose Fibrils in Fibrous Networks

Supachok Tanpichai, Franck Quero, Masaya Nogi, Hiroyuki Yano, Robert J Young, Tom Lindstrom, William W Sampson, and Stephen J. Eichhorn*
Biomacromolecules, 13 (5), 1340–1349 (2012)

DOI: 10.1021/bm300042t

Electrical conductivity enhancement in inkjet-printed narrow lines through gradual heating

Changjae Kim, Masaya Nogi*, Katsuaki Suganuma
Journal of Micromechanics and Microengineering, 22 , 035016(2012)

 DOI:10.1088/0960-1317/22/3/035016

機械的応力により発生するSn ウィスカにおける屈曲・湾曲部の形成と結晶方位の関係性、

水口由紀子、村上洋介、冨谷茂隆、浅井正、気賀智也、菅沼克昭
電子情報通信学会誌, 2012

Cu化合物添加型フラックスを用いたSn-3.5Ag/無電解Au/Ni電極接合部

の界面組織と接合強度評価,
櫻井 均, 久木元 洋一, 菅沼 克昭
電子情報通信学会論文誌, 2012

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