2013 Article

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The behavior of solder paste in stencil printing with electropolishing process

Y.-W. Lee, K.-S. Kim, K. Suganuma

Soldering & Surface Mount Technology, 25 [3] (2013),

DOI:10.1108/SSMT-12-2012-0027

Mitigation of Sn Whisker Growth by Small Bi Additions

Jung-Lae Jo, Shijo Nagao, Kyoko Hamasaki, Masanobu Tsujimoto, Tohru
Sugahara, Katsuaki Suganuma

Journal of Electronic Materials, 43 [1] (2013), 1-8

DOI:10.1007/s11664-013-2706-9

Retarding intermetallic compounds growth of Zn high-temperature solder and Cu substrate by trace element addition

S.W.Park, Shijo Nagao, Tohru Sugahara, Keun-Soo Kim, Katsuaki Suganuma

Materials in Electronics, 24 [12] (2013), 4704-4712

DOI:10.1007/s10854-013-1463-0

Thermal stress diven Sn whisker growth: in air and in vacuum

J. -L. Jo, S. Nagao, T. Sugahara, M. Tsujimoto, K. Suganuma

J Mater Sci: Mater Electron, 24 [10] (2013), 3897-3904

DOI:10.1007/s10854-013-1336-6

High-intensity pulse light sintering silver nanowire transparent films on polymer substrates: the effect the thermal properties of substrates on the performance of silver films

Jinting Jiu, Tohru Sugahara, Masaya Nogi, Teppei Araki, Hiroshi Uchida, Kenji Shinozaki, and Katsuaki Suganuma

Nanoscale, 5 (2013), 11820-11828

DOI: 10.1039/C3NR03152G

La doped effects on structure and thermoelectric properties of Sr2MnMoO6 double-perovskite oxides

T. Sugahara, M. Ohtaki, K. Suganuma

J. Asian Ceram. Soc., 1 [3] (2013), 282-288

DOI:10.1016/j.jascer

Cu Salt Ink Formulation for Printed Electronics using Photonic Sintering

Teppei Araki, Tohru Sugahara, Jinting Jiu, Shijo Nagao, Masaya Nogi,Hirotaka Koga,Hiroshi Uchida, Kenji Shinozaki, and Katsuaki Suganuma

Langmuir, 29 (2013), 11192–11197

DOI:10.1021/la402026r

Least Lead Addition to Mitigate Tin Whisker For Ambient Storage

Jung-Lae Jo, Keun-Soo Kim, Tohru Sugahara, Shijo Nagao, Kyoko Hamasaki, Masanobu Tsujimoto and Katsuaki Suganuma

Journal of materials science materials in electronics, 24 [8] (2013), 3108–3115

DOI 10.1007/s10854-013-1218-y

Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices

S. Sakamoto, S. Nagao, K. Suganuma

J Mater Sci: Mater Electron., 24 [4] (2013), 1332-1340

DOI:10.1007/s10854-013-1138-x

Electrical functionality of inkjet-printed silver nanoparticle conductive tracks on nanostructured paper compared with those on plastic substrates

T. T. Nge, M. Nogi, K. Suganuma

J. Mater. Chem. C, 1 [34] (2013), 5235-5243

DOI:10.1039/C3TC31220H

Low-temperature and low-pressure die bonding using thin Ag-flake and Ag-particle pastes for power devices

S. Sakamoto, K. Suganuma

IEEE Trans. CPMT, 3 [6] (2013), 1332-1340

DOI:10.1109/TCPMT.2013.2256463

Electrically conductive bacterial cellulose composite membranes produced by the incorporation of graphite nanoplatelets in pristine bacterial cellulose membranes

T. Zhou, D. Chen, T.T. Nge, T. Sugahara, S. Nagao, H. Koga, M. Nogi, K. Suganuma, X. Wang, X. Liu, P. Cheng, W. Wang, D. Xiong

Express Polymer Letters, 7 [9] (2013), 756-766

DOI:10.3144/expresspolymlett.2013.73

Foldable nanopaper antennas for origami electronics

M. Nogi, N. Komoda, K. Otsuka, K. Suganuma

Nanoscale, 5 [10] (2013), 4395-4399

DOI:10.1039/c3nr00231d

Electrically conductive lines on cellulose nanopaper for flexible electrical devices

M. C. Hsieh, C. Kim, M. Nogi, K. Suganuma

Nanoscale, 5 [19] (2013), 9289-9295

DOI:10.1039/C3NR01951A

High thermal stability of optical transparency in cellulose nanofiber paper

Masaya Nogi, Changjae Kim, Tohru Sugahara, Tetsuji Inui, Tsukasa Takahashi, and Katsuaki Suganuma

Appl. Phys. Lett., 102 [18] (2013), 181911

DOI:10.1063/1.4804361

Sn whisker growth on Sn plating with or without surface treatment during the room temperature exposure

K. -S. Kim, S. -S. Kim, Y. Yorikado, K. Suganuma, M. Tsujimoto, I. Yanada

J. Alloys. Compd., 558 (2013), 125-130

DOI: 10.1016/j.jallcom.2013.01.051

High-strength Si wafer bonding by self-regulated eutectic reaction with pure Zn

S.W. Park, T. Sugahara, S. Nagao, K. Suganuma

Scripta Materialia, 68 (2013), 591–594

DOI:10.1016/j.scriptamat.2012.12.013

Microstructural stability of Ag sinter joining in thermal cycling

Soichi Sakamoto, Tohru Sugahara, Katsuaki Suganuma

Journal of Materials Science: Materials in Electronics, 24 (2013), 1332-1340

DOI:10.1007/s10854-012-0929-9

Ag nanowires: large-scale synthesis via a trace-salt-assisted solvothermal
process and application in transparent electrodes

Jinting Jiu, Tohru Sugahara, Masaya Nogi, Katsuaki Suganuma

Journal of Nanoparticle Research, 15 (2013), 1-13

DOI:10.1007/s11051-013-1588-3

Low-temperature pressure-less silver direct bonding

T. Kunimune, M. Kuramoto, S. Ogawa, M. Niwa, M. Nogi, K. Suganuma

IEEE Trans. CPMT, 3 [3] (2013), 363-369

DOI:10.1109/TCPMT.2012.2231901

Transparent, conductive and printable composites consisting of TEMPO-oxidized nanocellulose and carbon nanotube

H. Koga, T. Saito, T. Kitaoka, M. Nogi, K. Suganuma, A. Isogai,

Biomacromolecules, 14 (2013), 1160-1165

DOI: 10.1021/bm400075f

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