2013 Article

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The behavior of solder paste in stencil printing with electropolishing process

Y.-W. Lee, K.-S. Kim, K. Suganuma

Soldering & Surface Mount Technology, 25 [3] (2013)

DOI:10.1108/SSMT-12-2012-0027

Mitigation of Sn Whisker Growth by Small Bi Additions

Jung-Lae Jo, Shijo Nagao, Kyoko Hamasaki, Masanobu Tsujimoto, Tohru
Sugahara, Katsuaki Suganuma
Journal of Electronic Materials, Volume 43, Issue 1 , pp 1-8

DOI:10.1007/s11664-013-2706-9

Retarding intermetallic compounds growth of Zn high-temperature solder and Cu substrate by trace element addition

S.W.Park, Shijo Nagao, Tohru Sugahara, Keun-Soo Kim, Katsuaki Suganuma

Materials in Electronics, Volume 24, Issue 12 , pp 4704-4712

DOI:10.1007/s10854-013-1463-0

Thermal stress diven Sn whisker growth: in air and in vacuum

J. -L. Jo, S. Nagao, T. Sugahara, M. Tsujimoto, K. Suganuma

J Mater Sci: Mater Electron, 24 [10] 3897-3904 (2013)

DOI:10.1007/s10854-013-1336-6

High-intensity pulse light sintering silver nanowire transparent films on polymer substrates: the effect the thermal properties of substrates on the performance of silver films

Jinting Jiu, Tohru Sugahara, Masaya Nogi, Teppei Araki, Hiroshi Uchida,
Kenji Shinozaki, and Katsuaki Suganuma
Nanoscale, 2013,5, 11820-11828

DOI: 10.1039/C3NR03152G

La doped effects on structure and thermoelectric properties of Sr2MnMoO6 double-perovskite oxides

T. Sugahara, M. Ohtaki, K. Suganuma

J. Asian Ceram. Soc., 1 [3] 282-288 (2013)

DOI:10.1016/j.jascer

Cu Salt Ink Formulation for Printed Electronics using Photonic Sintering

Teppei Araki, Tohru Sugahara, Jinting Jiu, Shijo Nagao, Masaya Nogi,Hirotaka Koga,Hiroshi Uchida, Kenji Shinozaki, and Katsuaki Suganuma

Langmuir, 29 , 11192–11197 (2013).

DOI: 10.1021/la402026r

Least Lead Addition to Mitigate Tin Whisker For Ambient Storage

Jung-Lae Jo, Keun-Soo Kim, Tohru Sugahara, Shijo Nagao, Kyoko Hamasaki, Masanobu Tsujimoto and Katsuaki Suganuma
Journal of materials science materials in electronics (2013)

DOI 10.1007/s10854-013-1218-y

Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices

S. Sakamoto, S. Nagao, K. Suganuma

J Mater Sci: Mater Electron. 24 [4] 1332-1340 (2013)

DOI:10.1007/s10854-013-1138-x

Electrical functionality of inkjet-printed silver nanoparticle conductive tracks on nanostructured paper compared with those on plastic substrates

T. T. Nge, M. Nogi, K. Suganuma

J. Mater. Chem. C, 1[34] 5235-5243 (2013)

DOI:10.1039/C3TC31220H

Low-temperature and low-pressure die bonding using thin Ag-flake and Ag-particle pastes for power devices

S. Sakamoto, K. Suganuma

IEEE Trans. CPMT, 3 [6] 1332-1340 (2013)

DOI:10.1109/TCPMT.2013.2256463

Electrically conductive bacterial cellulose composite membranes produced by the incorporation of graphite nanoplatelets in pristine bacterial cellulose membranes

T. Zhou, D. Chen, T.T. Nge, T. Sugahara, S. Nagao, H. Koga, M. Nogi, K. Suganuma, X. Wang, X. Liu, P. Cheng, W. Wang, D. Xiong

Express Polymer Letters, 7 [9] 756-766 (2013)

DOI:10.3144/expresspolymlett.2013.73

Foldable nanopaper antennas for origami electronics

M. Nogi, N. Komoda, K. Otsuka, K. Suganuma

Nanoscale, 5 4395-4399 (2013)

DOI:10.1039/c3nr00231d

Electrically conductive lines on cellulose nanopaper for flexible electrical devices

M. C. Hsieh, C. Kim, M. Nogi, K. Suganuma

Nanoscale 5 [19] 9289-9295 (2013)

DOI:10.1039/C3NR01951A

High thermal stability of optical transparency in cellulose nanofiber paper

Masaya Nogi, Changjae Kim, Tohru Sugahara, Tetsuji Inui, Tsukasa Takahashi, and Katsuaki Suganuma
Appl. Phys. Lett. 102, 181911-1–181911-4 (2013).

http://dx.doi.org/10.1063/1.4804361

Sn whisker growth on Sn plating with or without surface treatment during the room temperature exposure

K. -S. Kim, S. -S. Kim, Y. Yorikado, K. Suganuma, M. Tsujimoto, I. Yanada

J. Alloys. Compd., 558 125-130 (2013)

DOI: 10.1016/j.jallcom.2013.01.051

High-strength Si wafer bonding by self-regulated eutectic reaction with pure Zn

S.W. Park, T. Sugahara, S. Nagao, K. Suganuma
Scripta Materialia 68,591–594 (2013)

DOI 10.1016/j.scriptamat.2012.12.013

Microstructural stability of Ag sinter joining in thermal cycling

Soichi Sakamoto, Tohru Sugahara, Katsuaki Suganuma
Journal of Materials Science: Materials in Electronics,24,1332-1340(2013)

DOI 10.1007/s10854-012-0929-9

Ag nanowires: large-scale synthesis via a trace-salt-assisted solvothermal
process and application in transparent electrodes

Jinting Jiu*, Tohru Sugahara, Masaya Nogi, Katsuaki Suganuma
Journal of Nanoparticle Research, 15,1-13(2013)

DOI 10.1007/s11051-013-1588-3

Low-temperature pressure-less silver direct bonding

T. Kunimune, M. Kuramoto, S. Ogawa, M. Niwa, M. Nogi, K. Suganuma

IEEE Trans. CPMT, 3[3] 363-369 (2013)

DOI:10.1109/TCPMT.2012.2231901

Transparent, conductive and printable composites consisting of TEMPO-oxidized nanocellulose and carbon nanotube

H. Koga, T. Saito, T. Kitaoka, M. Nogi, K. Suganuma, A. Isogai,

Biomacromolecules, 14 1160-1165 (2013)

DOI: 10.1021/bm400075f

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