2014 Article

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Silver Nanowire Electrodes: Conductivity Improvement Without Post-treatment and Application in Capacitive Pressure Sensors

Jun Wang, Jinting Jiu, Teppei Araki, Masaya Nogi, Tohru Sugahara, Shijo Nagao, Hirotaka Koga, Peng He, Katsuaki Suganuma

Nano-Micro Letters, 7 [1] (2014) 51-58


‘Chrysanthemum petal’ arrangements of silver nano wires

Hui-Wang Cui, Jin-Ting Jiu, Tohru Sugahara, Shijo Nagao, Katsuaki Suganuma and Hiroshi Uchida

Nanotechnology, 25 [48] (2014), 485705


Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current

Youngseok Kim, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma, Minoru Ueshima, Hans-Juergen Albrecht, Klaus Wilke, Joerg Strogies

Journal of Electronic Materials, 43 [12] (2014), 4428-4434

DOI: 10.1007/s11664-014-3377-x

Pressureless Bonding Using Sputtered Ag Thin Films

Chulmin Oh, Shijo Nagao, Katsuaki Suganuma

Journal of Electronic Materials, 43 [12] (2014), 4406-4412

DOI: 10.1007/s11664-014-3355-3

Sol–Gel-Derived High-Performance Stacked Transparent Conductive Oxide Thin Films

Tohru Sugahara, Yukiko Hirose, Shuren Cong, Hirotaka Koga, Jinting Jiu, Masaya Nogi, Shijo Nagao and Katsuaki Suganuma

Journal of the American Ceramic Society, 97 [10] (2014), 3238–3243

DOI: 10.1111/jace.13116

Hillock growth dynamics for Ag stress migration bonding

Chulmin Oh, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma

Materials Letters, 137 [15] (2014), 170-173

DOI: 10.1016/j.matlet.2014.09.006

Thin Film CIGS Solar Cell Based on Low Temperature and All Printing Process

Manjeet Singh, Jinting Jiu, Tohru Sugahara, and Katsuaki Suganuma

ACS Appl. Mater. Interfaces6 [18] (2014), 16297–16303

DOI: 10.1021/am504509r

Photonic sintering of thin film prepared by dodecylamine capped CuInxGa1 − xSe2 nanoparticles for printed photovoltaics

Manjeet Singh, Jinting Jiu, Tohru Sugahara, Katsuaki Suganuma

Thin Solid Films, 565 [28] (2014), 11–18DOI:10.1016/j.tsf.2014.06.036

Using Ozawa method to study the curing kinetics of electrically conductive adhesives

Hui-Wang Cui, Jin-Ting Jiu, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma, Hiroshi Uchida

Journal of Thermal Analysis and Calorimetry, 6 [18] (2014), 16297–16303


Enhanced reliability of Sn-Ag-Bi-In joint under electric current stress by adding Co/Ni elements

Youngseok Kim, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma, Minoru Ueshima, Hans-Juergen Albrecht, Klaus Wilke and Joerg Strogies

Journal of Materials Science: Materials in Electronics, 25 [7] (2014), 3090-3095


Pressureless wafer bonding by turning hillocks into abnormal grain growth in Ag films

C. Oh, S. Nagao, T. Kunimune, K. Suganuma

Appl. Phys. Letters, 104 (2014), 161603


Uniformly connected conductive networks on cellulose nanofiber paper for transparent paper electronics

H. Koga, M. Nogi, N. Komoda, T. T. Nge, T. Sugahara, K. Suganuma

NPG Asia Metrials, 6 (2014), e93


Effect of electromigration on mechanical shock behavior in solder joints of surface mounted chip components

Youngseok Kim, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma, Minoru Ueshima, Hans-Juergen Albrecht, Klaus Wilke and Joerg Strogies

Japanese Journal of Applied Physics, 53 [4S] (2014), 04EB02


Low haze transparent electrodes and highly conducting air dried films with ultra-long silver nanowires synthesized by one-step polyol method

T. Araki, J. Jiu, M. Nogi, H. Koga, S. Nagao, T. Sugahara, K. Suganuma

Nano Research, 7 [2] (2014), 236-245


Facile synthesis of very-long silver nanowires for transparent electrodes

Jinting Jiu, Teppei Araki, Jun Wang, Masaya Nogi, Tohru Sugahara, Nagao Shijo, Hirotaka Koga, Katsuaki Suganuma, Eri Nakazawa, Masanao Hara, Hiroshi Uchida, and Kenji Shinozaki

Journal of Materials Chemistry A, 2 [18] (2014), 6326-6330


Mechanical stabilities of ultrasonic Al ribbon bonding on electroless nickel immersion gold finished Cu substrates

Semin Park, Shijo Nagao, Tohru Sugahara, and Katsuaki Suganuma

Japanese Journal of Applied Physics, 53 [4S] (2014), 04EP06


Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics

Hui-Wang Cui, Jin-Ting Jiu, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma,
Hiroshi Uchida and Kurt A. Schroder

RSC Advances, 4 (2014), 15914-15922


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