2015 Article

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Decarboxylation and simultaneous reduction of silver(I) β-ketocarboxylates with three types of coordinations

Mariko Hatamura,   Shunro Yamaguchi,  Shin-ya Takane,   Yu Chen and   Katuaki Suganuma

Dalton Trans., 2015,44, 8993-9003

DOI: 10.1039/C5DT00773A

Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density

Takuya Kadoguchi, Keisuke Gotou , Kimihiro Yamanaka, Shijo Nagao, Katsuaki Suganuma

Microelectronics Reliability, Volume 55, Issue 12, Part A, December 2015,
Pages 2554-2559


Fast fabrication of copper nanowire transparent electrodes by a high intensity pulsed light sintering technique in air

Su Ding,   Jinting Jiu,  Yanhong Tian,  Tohru Sugahara,  Shijo Nagao and   Katsuaki Suganuma

Phys. Chem. Chem. Phys., 2015

DOI: 10.1039/C5CP04582G

Fabrication of flexible copper pattern based on sub-micro copper paste by low temperature plasma technique

Yue Gao,   Hao Zhang,   Jinting Jiu,   Shijo Nagao,   Tohru Sugahara and    Katsuaki Suganuma

RSC Adv., 2015, Accepted Manuscript, Oct 2015

DOI: 10.1039/C5RA18583A

Laser-induced forward transfer of high-viscosity silver precursor ink for non-contact printed electronics

Tetsuji Inui, Rajesh Mandamparambil, Teppei Araki, Robert Abbel, Hirotaka Koga, Masaya Nogia and Katsuaki Suganuma

RSC Adv., 2015,5, 77942-77947

DOI: 10.1039/C5RA14119B

Non-toxic precursor solution route for fabrication of CZTS solar cell based on all layers solution processed

Manjeet Singh, Jinting Jiu, Katsuaki Suganuma, JunHo Kim

Journal of Alloys and Compounds, Volume 646, 15 October 2015, Pages 497–502 (Letter)


Addition of SiC Particles to Ag Die-Attach Paste to Improve High-Temperature Stability; Grain Growth Kinetics of Sintered Porous Ag

Hao Zhang, Shijo Nagao, Katsuaki Suganuma

J. Electron. Mater., October 2015, Volume 44, Issue 10, pp 3896-3903

DOI: 10.1007/s11664-015-3919-x

Highly Reliable Silver Nanowire Transparent Electrode Employing Selectively Patterned Barrier Shaped by Self-Masked Photolithography

Wang J, Jiu J, Sugahara T, Nagao S, Nogi M, Koga H, He P, Suganuma K, Uchida H.

ACS Appl. Mater. Interfaces, Article ASAP, September 2015DOI10.1021/acsami.5b07619

Pressureless Ag Thin-Film Die-Attach for SiC Devices

Chulmin Oh, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma

Materials Science Forum 821, 919-922 (2015)

DOI: 10.4028/www.scientific.net/MSF.821-823.919

Nanoscale Dynamic Mechanical Analysis on Heat-Resistant Silsesquioxane Nanocomposite for Power-Device Packaging

Shijo Nagao, Naoki Fujisawa, Takuo Sugioka, Satoshi Ogawa, Teruhisa Fujibayashi, Takaaki Wada, Tohru Sugahara, Katsuaki Suganuma

Materials Science Forum 821, 923-926 (2015)

DOI: 10.4028/www.scientific.net/MSF.821-823.923

High performance heat curing copper-silver powders filled electrically conductive adhesives

Hui-Wang Cui, Jin-Ting Jiu, Tohru Sugahara, Shijo Nagao, Katsuaki Suganuma, Hiroshi Uchida

Electron. Mater. Lett. 11(2), 315-322 (2015)

DOI: 10.1007/s13391-014-4292-2

Targeted kinetic strategy for improving the thermal conductivity of epoxy composite containing percolating multi-layer graphene oxide chains

T. Zhou, H. Koga, M. Nogi, T. Sugahara, S. Nagao, T. T. Nge, K. Suganuma, H-W. Cui, F. Liu, Y. Nishina

Exp. Polym. Lett. 9(7), 608-623 (2015)

DOI: 10.3144/expresspolymlett.2015.57

Using the Friedman method to study the thermal degradation kinetics of photonically cured electrically conductive adhesives

Hui-Wang Cui, Jin-Ting Jiu, Tohru Sugahara, Shijo Nagao, Katsuaki Suganuma, Hiroshi Uchida, Kurt A Schroder

J. Therm. Anal. Calori. 119(1) 425-433 (2015)

High-Temperature Die Attachment Using Sn-Plated Zn Solder for Power Electronics

Park, S. Nagao, S. Kato, Y. Ishino, H. Sugiura, K. Tsuruta, K. Suganuma

Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:PP ,  Issue: 99 )

Growth and Extension of One–Step Sol–Gel Derived Molybdenum Trioxide Nanorods via Controlling Citric Acid Decomposition Rate

Shuren Cong, Tohru Sugahara*, Tingting Wei, Jinting Jiu, Yukiko Hirose, Shijo Nagao, and Katsuaki Suganuma

Cryst. Growth Des., 2015, 15 (9), pp 4536–4542, July 2015

Heel crack propagation mechanism of cold-rolled Cu/Al clad ribbon bonding in harsh environment

Semin Park, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma
Journal of Materials Science: Materials in Electronics, June 2015, Volume 26, Issue 9, pp 7277-7289

Simultaneous synthesis of nano and micro-Ag particles and their application as a die-attachment material

Jinting Jiu, Hao Zhang, Shunsuke Koga, Shijo Nagao, Yasuha Izumi, Katsuaki Suganuma
Journal of Materials Science: Materials in Electronics June 2015, 12 Jun 2015

Surface modification of Cu flakes through Ag precipitation for low-temperature pressureless sintering bonding

S.W. Park, T. Sugahara, M. Hatamura, N. Kagami, S. Sakamoto, S. Nagao, K. Suganuma

Materials Letters Volume 151, 15 July 2015, Pages 68–71, 20 Mar 2015

DOI: 10.1016/j.matlet.2015.03.054

The effect of light and humidity on the stability of silver nanowire transparent electrodes

Jinting Jiu, Jun Wang, Tohru Sugahara, Shijo Nagao, Masaya Nogi, Hirotaka Koga, Katsuaki Suganuma, Masanao Hara, Eri Nakazawa and Hiroshi Uchida
RSC Advances, 2015 Accepted manuscript, 9 Mar 2015

Quasi-transient liquid-phase bonding by eutectic reaction of Sn-plated Zn on Cu substrate for high-temperature die attachment

S. W. Park, S. Nagao, Y. Kato, H. Ishino, K. Sugiura, K. Tsuruta, K. Suganuma

Journal of Alloys and Compounds, In press, 5 Mar 2015

DOI: 10.1016/j.jallcom.2015.02.223

Ultra thermal stability of LED die-attach achieved by pressureless Ag stress-migration bonding at low temperature

Teppei Kunimune,  Masafumi Kuramoto,  Satoru Ogawa, Tohru Sugahara, Shijo nagao, Katsuaki Suganuma

Acta Materialia , Volume 89, Pages 133–140, 26 Feb 2015


 Silver stress migration bonding driven by thermomechanical stress with various substrates

Chulmin Oh, Shijo Nagao, Katsuaki Suganuma

Journal of Material Science: Materials in Electronics, 28 Jan 2015

DOI: 10.1007/s10854-015-2717-9

The role of Zn precipitates and Cl anions in pitting corrosion of Sn–Zn solder alloys

Jian-Chun Liu, SungWon Park, Shijo Nagao, Masaya Nogi, Hirotaka Koga, Ju-Sheng Ma, Gong Zhang, Katsuaki Suganuma

Corrosion Science, Volume92 March 2015 page 263-271, 24 Dec 2014

DOI: 10.1016/j.corsci.2014.12.014

Highly sensitive and flexible pressure sensor based on silver nanowires filled elastomeric interlayer and silver nanowires electrodes

Jun Wang, Jinting Jiu, Masaya Nogi, Tohru Sugahara, Shijo nagao, Hirotaka Koga, Peng He and Katsuaki Suganuma

Nanoscale, 2014, Accepted Manuscript, 22 Dec 2014


A Miniaturized Flexible Antenna Printed on a High Dielectric Constant Nanopaper Composite

Tetsuji Inui, Hirotaka Koga, Masaya Nogi, Natsuki Komoda, Katsuaki Suganuma

Advanced Materials, Volume 27, Issue 6, Pages 1112–1116

DOI: 10.1002/adma.201404555

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