2019 Article

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Necking growth and mechanical properties of sintered Ag particles with different shapes under air and N2 atmosphere

Chuantong Chen , Jeyun Yeom, Chanyang Choe, Guiming Liu, Yue Gao, Zheng Zhang, Bowen Zhang, Dongjin Kim, and Katsuaki Suganuma
J Mater Sci, 54 (2019), 13344–13357

Interfacial oxidation protection and thermal-stable sinter Ag joining on bare Cu substrate by single-layer graphene coating

Chuantong Chen, Zheng Zhang, Dongjin Kim, Bowen Zhang, Masami Tanioku, Takao Ono, Kazuhiko Matsumoto, Katsuaki Suganuma
Applied Surface Science, 497 (2019), 143797

Well-controlled decomposition of copper complex inks enabled by metal nanowire networks for highly compact, conductive, and flexible copper films.

Bowen Zhang, Chuantong Chen, Wanli Li, Jeyun Yeom and Katsuaki Suganuma.
Advanced Materials Interfaces, (2019), 1901550.

Fast and low-temperature sintering of Ag paste due to nanoparticles formed in situ

Jeyun Yeom, Hao Zhang, Cai-Fu Li, Katsuaki Suganuma
Journal of Materials Science: Materials in Electronics, 30 (2019), 18080–18087

Effect of polyol synthesis on sintering of microsized Ag particles

Jeyun Yeom, Zheng Zhang, Cai-Fu Li, Katsuaki Suganuma
Microelectronics Reliability, 100–101 (2019), 113340

Development of high-strength and superior thermal shock-resistant GaN/DBA die attach structure with Ag sinter joining by thick Ni metallization

Dongjin Kim, Chuantong Chen, Seungjun Noh, Seong-joon Lee, Zheng Zhang, Yukiharu Kimoto, Tohru Sgahara and Katsuaki Suganuma
Microelectronics Reliability 100–101 (2019), 113380

Improvement of high-temperature thermal aging reliability of Ag–Au joints by modifying Ni/Au surface finish

Z. Zhang, C. Chen, A. T.Wu, K. Suganuma
Journal of Materials Science: Materials in Electronics, 30(22) (2019), 20292-20301.

Measurement of heat dissipation and thermal-stability of power modules on DBC substrates with various ceramics by SiC micro-heater chip system and Ag sinter joining

Dongjin Kim, Yasuyuki Yamamoto, Shijo Nagao, Naoki Wakasugi, Chuantong Chen and Katsuaki Suganuma
Micromachines 10, (2019)745

Ag particles for sinter bonding: Flakes or spheres?

Jeyun Yeom, Shijo Nagao, Chuantong Chen, Tohru Sugahara, Hao Zhang, Chanyang Choe , Cai-Fu Li, and Katsuaki Suganuma
Appl. Phys. Lett. 114 (2019) 253103
DOI: 10.1063/1.5099140

Mechanical characteristic and fracture behavior of GaN/DBA die-attached during thermal aging: pressure-less hybrid Ag sinter joint and Pb-5Sn solder joint

Dongjin Kim, Chuantong Chen, Shijo Nagao and Katsuaki Suganuma
Journal of Materials Science: Material in Electronics (2019) (Published in online)

DOI: 10.1007/s10854-019-02563-8

Alloying and embedding of Cu-core/Ag-shell nanowires for ultra-stable stretchable and transparent electrodes

Bowen Zhang, Wanli Li, Masaya Nogi, Chuantong Chen, Yang Yang, Tohru Sugahara, Hirotaka Koga, Katsuaki Suganuma
ACS Applied Materials & Interfaces, 11 [20] (2019) 18540-18547
DOI: 10.1021/acsami.9b04169

CoW metallization for high strength bonding to both sintered Ag joints and encapsulation resins

Iwashige, T. Endo, K. Sugiura, K. Tsuruta, Y. Sakuma, S. Kurosaka, Y. Oda, C. Chen, S. Nagao, K. Suganuma
Journal of Materials Science: Materials in Electronics, 30 (2019) 11151-11163
DOI: 10.1007/s10854-019-01458-y

Effect of annealing Co-W-P metallization substrate onto its resin adhesion

Iwashige, T. Endo, K. Sugiura, K. Tsuruta, Y. Sakuma, S. Kurosaka, Y. Oda, C. Chen, S. Nagao, K. Suganuma
Journal of Materials Science: Materials in Electronics (2019) 1-11
DOI: 10.1007/s10854-019-01688-0.

Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air

Zhang Z, Chen C, Yang Y, et al.
Journal of Alloys and Compounds, 780 (2019) 435-442.
DOI: 10.1016/j.jallcom.2018.11.251

Enhancement of bonding strength in Ag sinter joining on Au surface finished substrate by increasing Au grain-size

Zhang Z, Chen C, Liu G, et al.
Applied Surface Science, 485 (2019) 468-475
DOI: 10.1016/j.apsusc.2019.04.228

Thermal stability improvement of sintered Ag die-attach materials by addition of transition metal compound particles

Kazuhiko SugiuraTomohito IwashigeKazuhiro TsurutaChuantong ChenShijo NagaoTohru Sugahara, and Katsuaki Suganuma
Applied Physics Letters, 114 [16] (2019) 161903
DOI: 10.1063/1.5094073


佐藤 直樹,大串 哲朗,若杉 直樹,竹下 一毅,陳 伝彤,長尾 至成,菅沼 克昭
エレクトロニクス実装学会誌, 22 [2] (2019) 1-9
DOI: 10.5104/jiep.22.164

Thermal shock reliability of a GaN die-attach module on DBA substrate with Ti/Ag metallization by using micron/submicron Ag sinter paste

Dongjin Kim, Chuantong Chen, Chun Pei, Zheng Zhang1, Shijo Nagao, Aiji Suetake, Tohru Sugahara, and Katsuaki Suganuma
Japanese Journal of Applied Physics, 58 (2019) SBBD15
DOI: 10.7567/1347-4065/ab0278

Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro sizes

Chuantong Chen and Katsuaki Suganuma
Materials & Design, 162 (2019) 311-321
DOI: 10.1016/j.matdes.2018.11.062

Low temperature low pressure solid-state porous Ag bonding for large area and its high-reliability design in die-attached power modules

Chuantong Chen, Dongjin Kim, Zhenghong Wang, Zheng Zhang, Yue Gao, Chanyang Choe and Katsuaki Suganuma
Ceramics International, 45 [7] (2019) 9573-9579
DOI: 10.1016/j.ceramint.2018.10.046

Large-Scale and Galvanic Replacement Free Synthesis of Cu@AgCore-Shell Nanowires for Flexible Electronics

Bowen Zhang, Wanli Li, Jinting Jiu, Yang Yang, Jiangbo Jing, Katsuaki Suganuma and Cai-Fu Li
Inorganic. Chemistry, 58 (2019) 3374-3381
DOI: 10.1021/acs.inorgchem.8b03460

Fully embedded CuNWs/PDMS conductor with highoxidation resistance and high conductivityfor stretchable electronics

Bowen Zhang, Wanli Li, Yang Yang, Chuantong Chen, Cai-Fu Li, and Katsuaki Suganuma
Journal of Material Science, 54 (2019), 6381–6392
DOI: 10.1007/s10853-019-03333-x1

Three-Dimensional  stretchable and transparent conductors with controllable strain-distribution based on template-assisted transfer printing

Wanli Li, Yang Yang, Bowen Zhang, Lingying Li, Guiming Liu, Cai-Fu Li, Jinting Jiu, Katsuaki Suganuma
ACS Applied Materials & Interfaces, 11 [2] (2019) 2140-2148
DOI: 10.1021/acsami.8b186701


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