2018 Conference

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Thermostable porous Ag die-attach structure for high-temperature power devices

International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2018), College Park, USA, June 25-27, 2018

Seungjun Noh, Hao Zhang, and Katsuaki Suganuma

Nearly perfect Ag joints prepared by Ag stress-migration-bonding (SMB) process

International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2018), College Park, USA, June 25-27, 2018

Hao Zhang, Seungjun Noh, Norio Asatani, Yukiharu Kimoto, Shijo Nagao and Katsuaki Suganuma

Failure evaluation of GaN die-attach on DBC substrate by acoustic emission

14th International ceramics congress(CIMTEC 2018), Perugia, Italy, June 4-8, 2018

C. Y. Choe, S. J. Noh, C. Chen, S. Nagao and K. Suganuma

Large area bonding technology by using solid porous Ag in die-attached modules

14th International ceramics congress(CIMTEC 2018), Perugia, Italy, June 4-8, 2018

Chuantong Chen, Chanyang choe, Katsuaki Suganuma

Stretchable wirings prepared with PU and silver flakes

The Minerals, Metals & Materials Society (TMS) 2018 Annual Meeting & Exhibition, Phoenix, Arizona, America, March 11-15, 2018

Cai-Fu Li, Hao Zhang, Wanli Li, Zhi-Quan Liu, Katsuaki Suganuma

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