2001 Conference

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High temperature degradation mechanism of conductive adhesive/Sn alloy interface,

K. Suganuma and M. Yamashita,
Proceedings of International Symposium on Advanced Packaging Materials, Processes, Properties and Interfaces, IMAPS, Georgia, (2001) pp. 23-22

Interface Microstructure of Sn-Zn-Bi Solder/Sn-10Pb Plating/Cu and High Temperature Stability,

K. Young-Sun, C.-W. Hwang and K. Suganuma,
International Conf. On Electronics Packaging (2001 ICEP), Tokyo, April 18-20, (2001) pp. 84-87

Upgrading Pb-free soldering technology(1)-Reflow soldering-,

T. Kiga, H. Matsubara and K. Suganuma,
Proc. EcoDesign2001: Second International Symposium on Environmentally Concious Design and Inverse Manufacturing, Tokyo, (2001) pp. S181-185

Effect of alloying additives microstructural and mechanical properties of Sn-Ag-Cu solder alloys,

K.-S. Kim, S.-H. Huh and K. Suganuma,
4th Pacific Rim International Conference on Advanced Materials and Processing (PRICM4), eds. By S. Hanada, Z. Zhong, S. W. Nam and R. N. Wright, Japan Inst. Metals, Honolulu, Hawaii, (2001) pp. 1051-1054

Thermal fatigue damageof lead-free soldered through-hole circuit,

S.-H. Huh, K.-S. Kim and K. Suganuma,
4th Pacific Rim International Conference on Advanced Materials and Processing (PRICM4), eds. By S. Hanada, Z. Zhong, S. W. Nam and R. N. Wright, Japan Inst. Metals, Honolulu, Hawaii, (2001) pp. 1071-1074

Influence of Bi addition on joint strength between electrode and Sn-3Ag lead-free solder,

C.-W. Hwang, and K. Suganuma,
4th Pacific Rim International Conference on Advanced Materials and Processing (PRICM4), eds. By S. Hanada, Z. Zhong, S. W. Nam and R. N. Wright, Japan Inst. Metals, Honolulu, Hawaii, (2001) pp. 1107-1110

Mechanical Properties of eutectic Sn-Bi solder with Ag addition,

T. Sakai and K. Suganuma,
4th Pacific Rim International Conference on Advanced Materials and Processing (PRICM4), eds. By S. Hanada, Z. Zhong, S. W. Nam and R. N. Wright, Japan Inst. Metals, Honolulu, Hawaii, (2001) pp. 1111-1114

IEP低温鉛フリーはんだプロジェクトの概要とアンケート調査結果,

須賀 唯知,菅沼 克昭,竹内 誠,
MES2001(第11回マイクロエレクトロニクスシンポジウム), 大阪, (2001) p. 7-10

Sn-Zn系鉛フリーはんだとCu電極との接合界面反応層の成長挙動と高温安定性,

金 槿銖,金 迎庵,黄 致元,許 硯桓,菅沼 克昭,中嶋 英雄,
MES2001(第11回マイクロエレクトロニクスシンポジウム), 大阪, (2001) pp. 255-258

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