2003 Conference

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In situ observation and simulation of solidification process in soldering SOP with Sn-Ag-Cu Lead-Free Alloy,

M. Haga, K.-S. Kim and K. Suganuma,
132nd TMS Annual Meeting & Exhibition, San Diego, California, March 26, (2003)

Interface microstructure between 42 alloy and Sn-based lead-free solder,

C. -W. Hwang, J. G. Lee, H. Mori and K. Suganuma,
132nd TMS Annual Meeting & Exhibition, San Diego, California, March 26, (2003)

Interfaces in lead-free soldering,

C.-W. Hwang, K.-S. Kim and K. Suganuma,
132nd TMS Annual Meeting & Exhibition, San Diego, California, March 26, (2003)

Analysis of surface reaction behavior for generating atomic hydrogen on Ni3Al surfaces,

M. Inoue and K. Suganuma,
132nd TMS Annual Meeting & Exhibition, San Diego, California, March 26, (2003)

Squeeze casting for low cost fabrication of advanced materials and joints,

K. Suganuma, M. Inoue and K. Tanihata,
Proc. US-Japan workshop on Low Cost Production of Ceramics and Related Materials, Osaka, March 17, (2003) pp. 83-89

Solderability and Interface Property of Sn-Zn-Bi on Metal Substrates,

Y-S. Kim, C-W. Whang and K. Suganuma,
International Conference on Electronics Packaging(ICEP2003), JIEP, Tokyo, April 16-18, (2003) pp. 345-348

Interfacial Reaction of Sn-based Lead-free Solder with Fe-42Ni Substrate,

C-W. Hwang, K. Suganuma,
International Conference on Electronics Packaging(ICEP2003), JIEP, Tokyo, April 16-18, (2003) pp. 360-365

Joining Silicon Carbide/Aluminum Composite,

M. Nakata, K. Tanihata and K. Suganuma,
International Conference on Electronics Packaging(ICEP2003), JIEP, Tokyo, April 16-18, (2003) pp. 381-386

Solderability and interface Property of Sn-Zn-Bi on Metal substrates,

Y. S. Kim, K. S. Kim,C. W. Hwang, and K. Suganuma,
International Conference on Electronics Packaging(ICEP2003), JIEP, Tokyo, April 16-18, (2003) pp. 345-348

Current Technology of Low Temperature Lead-Free Soldering and JIEP Project,

K. Suganuma, T. Kiga, M. Takeuchi, Q. Yu, K. Tanabe, K. Toi, H. Tanaka, Y. Kato, K. Sasaki, K. Takahashi, M. Tadauchi, T. Tsukui, T. Suga and T. Makimoto,
Internatiuonal Conference on Lead Free Electronics “Towards Imprementation of the RHS Directive”, IPC/Soldertech, Brussels, June 10-11, (2003) pp. 97-104

Interfacial stability of Sn-Ag-Cu lead-free solder with Ni-P alloy plating,

K. Suganuma, C.-W. Hwang, M. Kiso and S. Hashimoto,
Interl Technology Symposium, “Sesigning for next generation Computing Platforms”, San Jose, Sep.16-17, (2003) p. 18

Curing characteristics of nano paste for fine printed circuits,

K.-S. Kim, M. Hatamura, S. Yamaguchi and K. Suganuma,
Proc.3rd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronics 2003), Montreux, Switzerland, (2003) pp. 369-374

Development of New Sn-Ag-Cu Lead-free Solders Containing Fourth Elements,

K.-S. Kim and K. Suganuma,
Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, December 8-11, (2003) pp. 165-166

The cultured cartilage / porous β-tricalcium phosphate (TCP) system as an artificial joint model,

S. Aoki, S. Yamaguchi and K. Suganuma,
3rd Asian BioCeramics Symposium (ABC2003), Fukuoka, Japan, 18-20 November, (2003)

Synthesis and aldehyde absorption properties of Asp-OCP inclusion compound,

Aoki, A. Nakahira, H. Nakayama, K. Sakamoto, S. Yamaguchi and K. Suganuma,
12th International Symposium on Intercalation Compounds, Poznan, 1-5 June, (2003)

Formation and atomic structures of BnNn (n = 24-60) clusters studied by mass spectrometry, high-resolution electron microscopy and molecular orbital calculation,

T. Oku, A. Nishiwaki and I. Narita,
14th European Conference on Diamond, Diamond-Like Materials, Carbon Nanotubes, Nitrides and Silicon Carbide, Salzburg, Austria, Sept. 7-12, (2003) Abst. 5. 7. 12

Atomic structures and stabilities of zigzag and armchair-type boron nitride nanotubes studied by high-resolution electron microscopy and molecular mechanics calculation,

T. Oku and I. Narita,
14th European Conference on Diamond, Diamond-Like Materials, Carbon Nanotubes, Nitrides and Silicon Carbide, Salzburg, Austria, Sept. 7-12, (2003) Abstract Book 5. 8. 10

Formation, atomic structural optimization and electronic structures of tetrahedral carbon onion,

T. Oku, I. Narita and A. Nishiwaki,
14th European Conference on Diamond, Diamond-Like Materials, Carbon Nanotubes, Nitrides and Silicon Carbide, Salzburg, Austria, Sept. 7-12, (2003) Abstract Book 15. 6. 2

B12@B12@B60 and B12@(B12)12 giant clusters with doping atoms observed by high-resolution electron microscopy,

T. Oku,
International Symposium on Novel Carbon-Rich Organic Materials, Osaka, Sept. 29-30, (2003) Abstracts p. 50

Synthesis and atomic structures of boron nitride cage clusters and nanotubes,

T. Oku, I. Narita and A. Nishiwaki,
International Symposium on Novel Carbon-Rich Organic Materials, Osaka, Sept. 29-30, (2003) Abstracts p. 51

Molecular orbital calculations of endohedral B36N36 clusters with doping elements,

A. Nishiwaki and T. Oku,
International Symposium on Novel Carbon-Rich Organic Materials, Osaka, Sept. 29-30, (2003) Abstracts p. 52

Three-dimensional nanostructural characterization of B12-based cluster solids by HREM and crystallographic image processing,

T. Oku,
International Symposium on Scientific and Industrial Nanotechnology 2003, Osaka, Dec. 8-9, (2003) Abstracts p. 55

Atomic structures and electronic states of boron nitride nanocage clusters and nanotubes,

T. Oku, I. Narita and A. Nishiwaki,
Nanoscience and Nanotechnology on Quantum Particles 2003, Tokyo, Dec. 15-17, (2003) Abstracts p. 39

Formation and atomic structures of boron nitride nanohorns,

A. Nishiwaki and T. Oku,
Nanoscience and Nanotechnology on Quantum Particles 2003, Tokyo, Dec. 15-17, (2003) p. 19

Nanostructural characterization of B12-based cluster solids by HREM and crystallographic image processing,

T. Oku,
Nanoscience and Nanotechnology on Quantum Particles 2003, Tokyo, Dec. 15-17, (2003) Abstracts p. 18

Ag-Sn合金エポキシ系導電性接着剤を用いた高温信頼性に関する検討,

山下 宗哲,白井 恭夫,森光 正明,菅沼 克昭,
第13回マイクロエレクトロニクスシンポジウム(MES2003), 大阪, 10月16-17日, (2003)

ACFを用いたFPC/ガラス基板接続の信頼性,

宮本 篤司,井上 雅博,菅沼 克昭,
第13回マイクロエレクトロニクスシンポジウム(MES2003), 大阪, 10月16-17日, (2003)

Sn-Ag系鉛フリーはんだとNi-Pめっきとの界面形成および成長メカニズムにおけるCu添加の影響,

黄 致元,菅沼 克昭,木曽 雅之,橋本 滋雄,
第13回マイクロエレクトロニクスシンポジウム(MES2003), 大阪, 10月16-17日, (2003) pp. 37-40

各種鉛フリーはんだ銅箔の細り現象の検証,

穂阪 貴,中島 新作,金井 和久,竹内 誠,金 槿銖,菅沼 克昭,
第13回マイクロエレクトロニクスシンポジウム(MES2003), 大阪, 10月16-17日, (2003)

信頼性の高い鉛フリーはんだを選択するための金属学的アプローチ,

金 槿銖,黄 致元,菅沼 克昭,
JPCA ショー・アカデミックラボラトリー, 東京, 6月, (2003)

Sn-Ag-Cu鉛フリーはんだとAu/Ni-P合金めっきとの界面形成および反応層成長,

黄 致元,菅沼 克昭,
日本金属学会2003年秋期大会一般講演, 北海道大学, 10/11-14, (2003)

錫銀銅系鉛フリーはんだのその場観察とシミュレーションによる凝固過程解析,

金 槿銖,芳我 基治,菅沼 克昭,
日本金属学会秋期大会, 北海道大学, 10/11-14, (2003)

高温高湿環境試験によるSn-Zn系鉛フリーはんだの劣化挙動,

松浦 利典,金 槿銖,沼 克昭,
JIEP, 東京, 3月12-14日, 17 (2003) pp. 159-160

理論計算による元素内包BNナノケージの構造と物性,

西脇 篤史,奥 健夫,菅沼 克昭,
第25回フラーレン・ナノチューブ記念シンポジウム, Japan, 23-25 July, (2003) p. 134

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