2005 Conference

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Formation and atomic structures of boron nitride clusters nanotubes and nanohorns,

T. Oku, I. Narita, A. Nishiwaki and N. Koi,
1st Inter. Symp. Nanometer-scale Quantum Physics, Tokyo, Jan. 26-28, (2005) Abstracts P.108

Effect of endohedral element in B24N24 clusters on hydrogenation studied by molecular orbital calculation (Synthesis and purification of boron nitride cages),

N. Koi and T. Oku,
1st Inter. Symp. Nanometer-scale Quantum Physics, Tokyo, Jan. 26-28, (2005) Abstracts P1-6

Sn-Zn based low temperature lead-free solder and current status of lead-free in Japan,

K. Suganuma,
TMS Lead-free Technology Workshop, SanFrancisco, CA, February 13-17, (2005)

Effect of Bi and Pb on Oxidation in Humidity of Low Temperature Lead-Free Solder Systems,

K.-S. Kim and K. Suganuma,
TMS 134th Annual Meeting, San Francisco, CA, February 13-17, (2005) p. 315

Effect of Curing Conditions on the Interconnect Properties of Isotropic Conductive Adhesives Composed of an Epoxy-Based Binder,

M. Inoue and K. Suganuma,
Proc. 7th IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis, HDP’05, Shanghai, China, June 27-30, (2005) pp. 128-133

Test Speed Dependency of Peel Strength of ACF Joints,

M. Inoue and K. Suganuma,
Proc. 7th IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis, HDP’05, Shanghai, China, June 27-30, (2005) pp. 145-148

Synthesis and Magnetic Properties of Boron Nitride Nanocapsules Encaging Metal Nonoparticles,

T. Oku, I. Narita, and H. Tokoro,
13th International Symposium on Intercalation Compounds, Clermont-Ferrand, France, June 6-9, (2005) Abstract P030

Atomic Structures and Properties of Boron Nitride Nanohorns and Nanotubes,

T. Oku and A. Nishiwaki,
13th International Symposium on Intercalation Compounds, Clermont-Ferrand, France, June 6-9, (2005) Abstract C48

Fe Nanowire Encapsulated in Boron Nitride Nanotubes,

N. Koi, T. Oku, and M. Nishijima,
13th International Symposium on Intercalation Compounds, Clermont-Ferrand, France, June 6-9, (2005) Abstract P60

Formation of Ceramic Coatings on Porous Metals by Electrophoretic Sol-Gel Deposition, (Poster),

M. Inoue, S. -K. Hyun, K. Suganuma, and H. Nakajima,
MetFoam 2005, Kyoto, Japan, Sep. 21-23, (2005)

Development of Super-Flexible Wires Using Conductive Adhesives for Artificial Skin Applications in Robots and Related Equipments,

M. Inoue, Y. Yamasaki, K. Suganuma, T. Kawasaki, T. Rokuhara, T. Miyashita, and H. Ishiguro,
Proc, Polytronic 2005, Wroclaw, Poland, Oct. 23-26, (2005) pp. 90-95

Solidification Phenomenon in Pb-Free Soldering (Invited),

K. -S. Kim and K. Suganuma,
Intel Malaysia Pb-free Technology Forum, Penang, Malaysia, Jul. 18, (2005)

Properties of Low Temperature Solder Sn-Ag-In-Bi,

K. Suganuma, T. Imanishi, K.-S. Kim and M. Ueshima,
Materials Science & Technology 2005 Conference and Exhibition (MS&T’05), David L. Lawrence Convention Center, Pittsburgh, USA, Sep. 25-28, (2005)

Low Temperature Soldering Project of JEITA,

K. Suganuma, K. Yamamoto, K. Sasaki, H. Homma, H. Matsuoka, M. Takeuchi, K. Kusakabe, K. Toyofuku, K. Takahashi, Y. Nishiyama, Y. Kariya, Q. Yu, and K. Higuchi,
3rd Internatiuonal Conference on Lead Free Electronics “Towards Imprementation of the RHS Directive”, IPC/Soldertech, Balcerona, Spain, June 8-9, (2005)

リフロー/フロー混載実装におけるICリード剥離メカニズム,

出田 吾朗,
第2回中日無鉛はんだ付技術交流会(上海交通大学・大阪大学産業科学研究所共催), 上海,中国, 11月23日, (2005)

Sintering characteristics of Ag nano paste for fine printed circuits,

Keun-Soo Kim, Mariko Hatamura, Shunro Yamaguchi and Katsuaki Suganuma,
21st Century COE “Towards Creating New Industries Based on Inter-Nanoscience”, 3rd International Symposium, Shiga, Japan, Mar. 9-10, (2005) p. 129

Zn-Sn alloys for high temperature Pb-free soldering,

Jae-Ean Lee, Keun-Soo Kim and Katsuaki Suganuma,
21st Century COE “Towards Creating New Industries Based on Inter-Nanoscience”, 3rd International Symposium, Shiga, Japan, Mar. 9-10, (2005) p. 153

Research on Structures and Properties of Boron Nitride Nanomaterials,(Poster),

N. Koi, T. Oku, and K. Suganuma,
4th 21st Century COE International Symposium, Mie, Japan, November 18-19, (2005) Abstract P6

Nano Particle Paste Printing for Electronics Circuits,

K. Suganuma and K. -S. Kim,
21st Century COE “Towards Creating New Industries Based on Inter-Nanoscience”, 4th International Symposium, Toba, Japan, Nov. 18-19, (2005) pp. 28-31

Development and Evaluation of Zn-xSn and Zn-30In Alloys as High Temperature Lead-Free Solder,

J. -E. Lee, K. -S. Kim and K. Suganuam,
21st Century COE “Towards Creating New Industries Based on Inter-Nanoscience”, 4th International Symposium, Toba, Japan, Nov. 18-19, (2005) pp. 117-118

導電性接着剤実装からナノペースト配線まで(招待講演),

菅沼 克昭,
エレクトロニクス実装学会関西支部技術討論会『jisso技術の展望』, 大阪, 5月18日, (2005)

高温用鉛フリーはんだZn-xSnZn-30In合金の微細組織と引張強度特性,

李 在彦, 金 槿銖, 菅沼 克昭,
第15回マイクロエレクトロニクスシンポジウム(MES2005), 大阪大学, 10月13-14, (2005) pp. 229-232

導電性接着剤を用いた実装界面組織(招待講演),

菅沼 克昭,井上 雅博,金 槿銖,
大阪大学接合科学研究所 特別講演・研究集会「導電性接着のナノテクノロジーによる信頼性向上」, 大阪大学接合科学研究所 荒田記念館, 11月25日, (2005)

金属ナノ粒子ペーストによる微細配線技術の最前線(基調講演),

菅沼 克昭,
エレクトロニクス実装学会マイクロファブリケーション研究会第18回公開研究会, 東京, 12月18日, (2005)

Progress in lead-free soldering in Japan (invited),

K. Suganuma,
SMT China International Conference, SMT China, Shnaghai, (2005)

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