2007 Conference

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Conductive Adhesives: Alternative to High Temperature Solders and The Future (keynote),

K. Suganuma
IEEE Polytronic 2007 Conference, Tokyo, Japan, January 16-18, (2007) , pp.30-35

Novel Room Temperature Wiring of Ag Nanoparticle Paste,

Daisuke Wakuda, Mariko Hatamura, and Katsuaki Suganuma,
IEEE Polytronic 2007 Conference, Tokyo, Japan, January 16-18, (2007) pp. 110-113

Prevention of Sn Whisker Formation by Surface Treatment of Sn Plating (invited),

K. Suganuma, K.-S. Kim, Y. Yorikado, M. Tsujimoto, I. Yanada
136th TMS Annual Meeting & Exhibition, Orlando, TX, Feb.26-28 (2007)

微細回路パターン用銀ナノ粒子ペーストの常温焼結,

和久田大介,畑村真理子,菅沼克昭,
第21回エレクトロニクス実装学会講演大会, 早稲田大学, 3月14日-16日, (2007) pp. 107-108

Zn-Sn and Zn-In High Temperature Lead-Free Solders,

Katsuaki Suganuma, Jae-Ean Lee and Keun-Soo Kim
Symposium E: Pb-Free and RoHS-Compliant Materials and Processes for Microelectronics, 2007 MRS Spring Meeting, San Francisco, April 11-12 (2007)

Tin Whisker Formation On Fine Pitch Connectors,

K.Suganuma
International Symposium on Tin Whiskers, University of Maryland, April 25-26 (2007)

静電気を利用した触覚センサ,

多田 泰徳,井上 雅博,河崎 俊実,川人 康,石黒 浩,菅沼 克昭,
ロボティクス・メカトロニクス講演会’07, 5月10日-12日, (2007) pp. 1A2-A07

Ink-Jet Printing Nanoparticle Pastes for Printed Electronics (keynote),

K. Suganuma
International Conference on High Density Packaging(HDP2007), IEEE CPMT, Shanghai, June 27-28th (2007)

Current Status of Lead-Free Soldering and Its Future (keynote),

K. Suganuma
8th International Conference on Electronics Packaging Technology(ISEPT2007), Shanghai, August 14th – 17th (2007)

常温焼結ナノ粒子ペーストの性質および焼結メカニズム,

和久田大介,菅沼克昭,
エレクトロニクス実装学会MES2007, 甲南大学, 9月13日-14日, (2007) pp. 35-38

銀-エポキシ導電性接着剤の耐衝撃強度評価,

金道燮,カンミン,金槿銖,金善植,金声俊,菅沼克昭,干 強,
エレクトロニクス実装学会MES2007, 甲南大学, 9月13日-14日, (2007) pp. 51-54

Zn-Sn系高温鉛フリーはんだを用いたダイアタッチ,

金声俊,金槿銖,金道燮,菅沼克昭,
エレクトロニクス実装学会MES2007, 甲南大学, 9月13日-14日, (2007) pp. 83-86

Ag粒子ペーストの常温焼結と接合に関する研究,

和久田大介,菅沼克昭,
日本金属学会秋季大会, 岐阜大学, 9月19日-21日, (2007) pp. 253

Zn-Sn and Zn-In High Temperature Lead-Free Solders,

K. Suganuma, S.-J. Kim, J.-E. Lee, K.-S. Kim
The 40th International Symposium on Microelectronics(IMAPS2007), SanJose, November 11 – 15 (2007)

Impact Property Evaluation of Ag-Epoxy Conductive Adhesive Joint,

Do-Seop Kim, Min Kang, Keun-Soo Kim, Sun-Sik Kim, Seong-Jun Kim, Katsuaki Suganuma, Qiang Yu
The 40th International Symposium on Microelectronics(IMAPS2007), SanJose, November 11 – 15 (2007)

Design and Synthesis of Mesoporous Nano-Silver-Based Die Attach Material for High Power Electronics,

Katsuaki Suganuma, Jinting Jiu, Doseop Kim, Keunsoo Kim
The 40th International Symposium on Microelectronics(IMAPS2007), SanJose, November 11 – 15 (2007)

Room Temperature Sintering of Ag Nanoparticle Paste and Its Mechanism,

Daisuke Wakuda, and Katsuaki Suganuma,
2007 MRS Fall Meeting, Boston, USA, November 26-30, (2007)

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