2008 Conference

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アルコール浸漬処理法を用いたAgナノ粒子の焼結,

和久田大介,菅沼克昭,
第22回エレクトロニクス実装学会講演大会, 東京大学, 3月17日-19日, (2008) pp. 187-188

高温鉛はんだ代替材料の熱伝導特性評価,

金槿銖,金道燮,姜ミン,金声俊,菅沼克昭,
第29回日本熱物性シンポジウム,日本女子大学,10月8日‐10日(2008)330-332.

Zn-Sn系高温鉛フリーはんだのダイアタッチ接合特性,

金声俊,金槿銖,金善植,菅沼克昭,
エレクトロニクス実装学会(MES2008), 京都大学, 9月18日-19日,(2008)115-118.

Snウィスカ防止用表面ナノめっきの信頼性評価,

金 槿銖, 金 善植,濱崎 恭子,菅沼 克昭,辻本 雅宣,梁田 勇,
エレクトロニクス実装学会(MES2008), 京都大学, 9月18日-19日,(2008)119-122.

常温焼結Ag粒子ペーストの性質と常温接合,

和久田大介,金槿銖,菅沼克昭,
エレクトロニクス実装学会(MES2008), 京都大学, 9月18日-19日, (2008) pp. 147-150.

Room Temperature Sintering Mechanism of Ag Nanoparticle Paste,

Daisuke Wakuda, Chang-Jae Kim, Keun-Soo Kim, and Katsuaki Suganuma,
IEEE 2nd Electronics System-Integration Technology Conference, Greenwich,
UK, September 1-4, (2008)

Reliability of die attached AlN-DBC module using Zn-Sn high temperature lead-free solders,

Seongjun Kim, Keun-Soo Kim, Goro Izuta and Katsuaki Suganuma,
2nd Electronics System-Integration Technology Conference (ESTC 2008), University of Greenwich, London, UK, September 1-4 (2008) 411-416

Degradation Mechanism of Ag-Epoxy Conductive Adhesive Joints by Heat and Humidity Exposure,

Sun Sik Kim, Keun Soo Kim, Katsuaki Suganuma and Hirokazu Tanaka,
2nd Electronics System-Integration Technology Conference (ESTC 2008), University of Greenwich, London, UK, September 1-4 (2008) 903-908.

Synthesis of Ag nanorods and application to soft die attaching,

J. Jiu, K. Murai, K.S. Kim and K. Suganuma,
7th IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics, Germany, August 17-20 (2008).

Room Temperature Sintering of Ag Nano-scale particles with drying of the
solvent,

Daisuke Wakuda, Keun-Soo Kim, and Katsuaki Suganuma,
IEEE Polytronic 2008 Conference, Garmisch-Partenkirchen, Germany, August
17-20, (2008)

Developing the Stencil Printing Process for 01005 Lead-Free Assemblies,

Yong-Won Lee, Keun-Soo Kim, Katsuaki Suganuma, Jong-Hoon Kim,
2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), Shanghai, China, July 28-31 (2008).

Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu solders,

Alongheng, K.-S. Kim, K. Suganuma, S. Huang, and M. Ueshima
2008 International Materials Research Conference, Chongqing, China, June 9 – 12, 2008

Large-sacel synthesis of micrometer-scale single-crystal gold nanosheets by polyol process,

J. Jiu, K. Suganuma, K.-S. Kim, T. Nemoto, T. Ogawa and S. Isoda
2008 International Materials Research Conference, Chongqing, China, June 9 – 12, 2008

Zn-Sn high temperature lead-free solders

K. Suganuma, K.-S. Kim, J.-E. Lee and K.-S. Kim
2008 International Materials Research Conference, Chongqing, China, June 9 – 12, 2008

Interfacial Reactions of Die Attached AlN-DBC Module Using Zn-Sn High Temperature Solders,

S.-J. Kim, K.-S. Kim, D.-S. Kim, K. Suganuma
TMS 2008 Annual Meeting & Exhibition, New Orleans, March 10-14, 2008.

Degradation of Ag-Epoxy Conductive Adhesive/Sn Interface in Humid Atmosphere,

Sun Sik Kim, Keun Soo Kim, Katsuaki Suganuma
TMS 2008 Annual Meeting & Exhibition, New Orleans, March 10-14, 2008.

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