2009 Conference

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Low temperature wiring with Ag inks-New-ketocarboxylate Ag inks for 100oC curing,

Mitsuru Kawazome, Keun-Soo Kim, and Katsuaki Suganuma,
9th Nanotechnology Conference (IEEE NANO 2009), Genoa, Italy, July 28-30 (2009) 7-9.

Time-dependent sintering properties of Ag nanoparticle paste for room temperature bonding,

Daisuke Wakuda, Keun-Soo Kim, and Katsuaki Suganuma,
9th Nanotechnology Conference (IEEE NANO 2009), Genoa, Italy, July 28-30 (2009)498-501.

Whisker Research Efforts and Findings by JEITA,

K. Suganuma, K.S. Kim, Y. Shimada, K. Yamamoto, T. Kudoh, N. Nakamura and H. Oshima, 3rd International Symposium on Tin Whiskers, Technical University of Denmark, Lyngby, Denmark, June 23-23 (2009).

Ink-jet Printing of Ag Nanoparticle and Ag carboxylate Inks on Papers,

Mitsuru Kawazome, Keun-Soo Kim, and Katsuaki Suganuma,
59th Electronic Components & Technology Conference (ECTC 2009), San Diego, CA, USA, May 26-29 (2009) 1325-1329.

Properties of Ag Nanoparticle Paste for Room Temperature Bonding,

Daisuke Wakuda, Keun-Soo Kim, and Katsuaki Suganuma,
59th Electronic Components & Technology Conference (ECTC 2009), San Diego, CA, USA, May 26-29 (2009) 1557-1562.

Joining Characteristics of Various High Temperature Lead-free Interconnection Materials,

K. Suganuma, K.S. Kim, S.S. Kim, D.S. Kim, M. Kang, and S.J. Kim,
59th Electronic Components & Technology Conference (ECTC 2009), San Diego, CA, USA, May 26-29 (2009) 1764-1768.

Room Temperature Sintering and Bonding with Ag Nanoparticle Paste,

Daisuke Wakuda, Keun-Soo Kim, Katsuaki Suganuma,
2009 International Conference on Electronics Packaging (ICEP2009), Kyoto International Conference Center, Kyoto, Japan, April 14-16 (2009)

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