2010 Conference

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Sn-Ag-Cu Soldering Reliability Influenced by Process Atmosphere,

Alongheng Baated, Junxiang Jiang, Keun-Soo Kim, Katsuaki Suganuma, Sharon Huang, Benjamin Jurcik, Shigeyoshi Nozawa, and Minoru Ueshima,
2007 International Symposium on High Density Packaging and Microsystem Integration (HDP’07), Shanghai, China, June 26-28 (2007), 110-114.

Effects of Reflow Atmosphere and Flux on Sn whisker Growth of Sn-Ag-Cu Solders,

Alongheng Baated, Keun-Soo Kim, Katsuaki Suganuma, Sharon Huang, Benjamin Jurcik, Shigeyoshi Nozawa, and Minoru Ueshima,
MRS International Materials Research Conference, Chongqing, China, 2008, 89.

Investigation of Mechanism for Spontaneous Zinc whiskerGrowth from an Electroplated Zinc Coating,

Alongheng Baated, Keun-Soo Kim, and Katsuaki Suganuma,
2009 International Symposium on High Density Packaging and Microsystem Integration (HDP’09), Beijing, China, 2009, 1019-1022.

Mechanism for Spontaneous Zinc Whisker Growth from an Electroplated Zinc Coating,

Alongheng Baated, Keun-Soo Kim, and Katsuaki Suganuma,
Proceedings of the 24th JIEP Annual Meeting, Tokyo, Japan (March, 2010), 36-37.

Intermetallic Growth Rate Effects on Spontaneous Whisker Growth from Tin Coating on Copper,

Alongheng Baated, Keun-Soo Kim, and Katsuaki Suganuma,
International Conference on Electronics Packaging (ICEP2010), Sapporo, Japan, 2010, 349-353.

Effects of the Sn plating structure and surface coating layer on Sn whisker growth,

Keun-Soo Kim, Kyoko Hamasaki, Ki Ju Lee, Alongheng Baated, Katsuaki Suganuma, M. Tsujimoto, MES2009, the 19th Micro Electronics Symposium, Fukuoka, Japan, 2009, 65-68.

Optically transparent substrates from plants nanofibers for printed electronics,

M. Nogi, K.Suganuma, and H. Yano,
Proceedings of LOPE-C 2010, Frankfurt, German, 2010, 246-250.

Super Stretchable and Flexible Conductive Elastomer Tracks by Screen Printing

T. Araki, K. Suganuma, M. Nogi, K. Kihara, M. Kogure, O. Kirihara,
Proceedings of ICFPE 2010, Hsinchu, Taiwan, 2010, 2page.

Low Temperature Nano-Ag Wiring on Textiles by Ink-jet print,

J. Jiu, K. Suganuma, C. Kim, D. Wakuda, M. Nogi, Y. Linm P. Chen,
Proceedings of ICFPE 2010, Hsinchu, Taiwan, 2010, 2page.

Effect of Zn-Containing Flux on the Joint Strength and Microstructure of Sn-3.5Ag Soldering on an Electroless Ni-Au Surface Finish,

Hitoshi Sakurai, Youichi Kukimoto, Katsuaki Suganuma,
2010 TMS Annual Meeting & Exhibition, Seattle, Feb.14-18, 2010.

Effects of crystallographic orientation of Sn on electromigration behavior,

K. Lee, K.S. Kim, K. Yamanaka, Y. Tsukada, S. Kuritani, M. Ueshima, K. Suganuma,
IMAPS 2010-43rd International Symposium on Microelectronics, Raleigh Convention Center, NC, USA, Oct. 31-Nov.4 (2010) 792-797.

Effects of the crystallographic orientation of Sn grain during electromigration test,

K. Lee, K. S. Kim, K. Yamanaka, Y. Tsukada, S. Kuritani, M. Ueshima, K. Suganuma, .
IEEE CPMT Symposium Japan(ICSJ2010), The University of Tokyo, Tokyo, Japan, Aug. 24-26 (2010).

The effect of microvia-in-pads design on SMT defects in ultra-small component assembly,

Y.W. Lee, K.S. Kim, K. Suganuma,
2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010), Tang Cheng Hotel, Xi’an, China, Aug. 16-19 (2010).

Intermetallic growth rate effects on spontaneous whisker growth from Tin coating on copper,

A. Baated, K.S. Kim, K. Suganuma,
International Conference on Electronics Packaging (ICEP 2010), Sapporo Convention Center, Hokkaido, Japan, May 12-14 (2010) 349-353.

Ag-エポキシ系導電性接着剤の高温高湿環境下での微細組織変化,

金 槿銖、李 奇柱、金 善植、趙 亭来、菅沼克昭,田中浩和,
第20回マイクロエレクトロニクスシンポジウム(MES2010), 立命館大学, 滋賀, 9月9日~10日, (2010) 231-234.

Sn-Ag-Cuボール接合部のエレクトロマイグレーションに及ぼす錫結晶方位現象

李 奇柱,金 槿銖,山中 公博,塚田 裕,栗谷 聡一,上島 稔,菅沼 克昭,
第20回マイクロエレクトロニクスシンポジウム(MES2010), 立命館大学, 滋賀, 9月9日~10日,(2010) 43-46.

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