2011 Conference

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Thermo Mechanical Reliability of Low-temperature Low-pressure Die Bonding Using Thin Ag Flake Pastes

Soichi Sakamoto, Katuaki Suganuma
International Conference on Integrated Power Electronics Systems 2012, Nuremberg, Germany, 2012.3.6-8

Inkjet printing of well-defined and narrow conductive lines on polymeric substrates with chemical treated coating layers

C. Kim, M. Nogi, K. Suganuma
The 15th SANKEN International Symposium / The 10th SANKEN Nanotechnology Symposium, Osaka, Japan, 2012.1.12-13

Transparent electrodes with network structures of silver nanowires

T. Tokuno, M. Nogi, J. Jiu, K. Suganuma
The 15th SANKEN International Symposium / The 10th SANKEN Nanotechnology Symposium, Osaka, Japan, 2012.1.12-13

Thermo Mechanical Reliability of Low-temperature Low-pressure Die Bonding Using Thin Ag Flake Pastes

Soichi Sakamoto, Katuaki Suganuma
The 15th SANKEN International Symposium / The 10th SANKEN Nanotechnology Symposium, Osaka, Japan, 2012.1.12-13

Silver nanowire printed line; Relationship of Heating temperature and its conductivity

N. Komoda, M. Nogi, K. Suganuma
The 15th SANKEN International Symposium / The 10th SANKEN Nanotechnology Symposium, Osaka, Japan, 2012.1.12-13

Characteristics of Die Attach Joints with Zn High Temperature Lead-Free Solders

S.W. Park and K. Suganuma
ECO-MATES2011, Osaka, Japan, 2011.11.28-30

Behaviors of Sn surface with whisker generation after thermal cycle

Jung-Lae Jo, Kiju Lee, Katsuaki Suganuma
ECO-MATES2011, Osaka, Japan, 2011.11.28-30

Stretchable and conductive wirings having various electrical properties to different volume fraction of silver flakes

T. Araki, M. Nogi, K. Suganuma, K. Kihara, O. Kirihara
7th Handai Nanoscience and Nanotechnology INternational Symposium, Osaka, Japan, 2011.11.10-11

Inkjet Printing of Conductive Lines : Improvement of Line Morphology and Electrical Conductivity

C. J. Kim, M. Nogi, K. Suganuma
7th Handai Nanoscience and Nanotechnology INternational Symposium, Osaka, Japan, 2011.11.10-11

Electrical conductivity enhancement of silver nanowire transparent electrodes at low temperature

T. Tokuno, M. Nogi, J. Jiu, K. Suganuma
7th Handai Nanoscience and Nanotechnology INternational Symposium, Osaka, Japan, 2011.11.10-11

Silver nanowire flexible antenna for printed electronics

N. Komoda, M. Nogi, K. Kohno, K. Otsuka, K. Suganuma
7th Handai Nanoscience and Nanotechnology INternational Symposium, Osaka, Japan, 2011.11.10-11

Preparation of Ag Nanowires and Application in Optoelectronic Devices

Jinting Jiu, Takehiro Tokuno, Masaya Nogi, Katsuaki Suganuma
BIT’s 1st Annual World Congress of Nano-S&T-2011, Dalian, China, 2011.10.23-26

Effect of Cr addition on mechanical property and oxidation resistance of pure Zn as SiC die bonding material

S.W. Park, K.S. Kim and K. Suganuma
Materials Science & Technology 2011 Conference & Exhibition, Ohio, U.S.A, 2011.10.16-20

Growth mechanism of Sn whiskers in a vacuum and air with thermal cycling

J.L Jo, K.S Kim, K. Suganuma
Materials Science & Technology 2011 Conference & Exhibition, Ohio, U.S.A, 2011.10.16-20

Room temperature fabrication of silver nanowire transparent electrodes

T. Tokuno, M. Nogi, M. Karakawa, J. Jiu, Y. Aso, K. Suganuma
International Conference of Solid State Devices and Materials 2011, Nagoya, Japan, 2011.9.28-30

Low temperature die-bonding with Ag flakes

S. Sakamoto, K. Suganuma
European Microelectronics and Packaging Conference 2011, Brighton, UK, 2011.9.12-15

Die bonding materials for low temperature joinning with Ag flakes

S. Sakamoto, K. Suganuma
MES2011, Osaka, Japan, 2011.9.8-9

Preparation and characterization of bacterial cellulose/chitosan porous scaffolds

Thi Thi Nge, Masaya Nogi, Hiroyuki Yano, Junji Sugiyama
IAWS 2011, Stockholm, Sweden, 2011.8.31-9.2

Properties of Silver Nanowire Transparent Electrodes Fabricated by a Coating Method

Takehiro Tokuno, Masaya Nogi, Katsuaki Suganuma
IEEE Nano 2011, Portland, U.S.A, 2011.8.15-19

Effect of Ink Viscosity on Electrical Resistivity of Narrow Printed Silver Lines

ChangJae Kim, Masaya Nogi, Katsuaki Suganuma
IEEE Nano 2011, Portland, U.S.A, 2011.8.15-19

Return Loss of Printed Silver Paste Lines with Different Filler Sizes and Their Surface Roughness

Natsuki Komoda, Katsuaki Suganuma, Masaya Nogi
IEEE Nano 2011, Portland, U.S.A, 2011.8.15-19

Preparation of rod-shaped and spherical Silvernanoparticles and application for Packaging materials

Jinting Jiu, Masaya Nogi, Katsuaki Suganuma
ICEPT-HDP2011, Shanghai, China, 2011.8.8-11

Synthesis and application of silver nanowires

T. Tokuno, Masaya Nogi, Suganuma Katsuaki
CMOS Emerging Technologies 2011 Meeting, Whistler, Canada, 2011.7.15-17

Size Effect on Resistivity of Narrow Printed Tracks

ChangJae Kim, Masaya Nogi, Katsuaki Suganuma
ICEP2011, Nara, Japan, 2011.4.13-15

Microstructual Analysis of Wiskers Nucleated from Lead-Free Tin-copper Plating Films by Mechanical Stress

Yukiko Mizuguchi, Yosuke Murakami, Shigetaka Tomiya, Tadashi Asai, and Tomoya Kiga
ICEP2011, Nara, Japan, 2011.4.13-15

Improvement of Brittleness of Pure Zn by Addition of Minor Elements as High Temperature Lead-free Solder

S.W. Park, K.S. Kim and K. Suganuma
ICEP2011, Nara, Japan, 2011.4.13-15

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