2014 Conference

  1. Home
  2. Achievement
  3. Conference
  4. 2014

High-speed photo-reduction of graphene oxide for paper-based flexible supercapacitor

Hidetsugu Tonomura, Hirotaka Koga, Yuta Nishina, Masaya Nogi, Katsuaki Suganuma

The 18th SANKEN International Symposium 2014, Osaka, Japan, 2014. 12. 10-11

Silver Sinter Joining and New Thin Film bonding for WBG die-attach

K. Suganuma, S. Nagao, T. Sugahara, C. Oh, H. Zhang, S. Koga, S. Park,

International conference on Nanojoining and Microjoining 2014, Emmetten, Switzerland, 2014.12.07-10.

Paper-based supercapacitor electrodes prepared by a papermaking technique

Hidetsugu Tonomura, Hirotaka Koga, Yuta Nishina, Masaya Nogi, Katsuaki Suganuma
ICFPE2014, Beijing, China, 2014. 10. 21-23

CIGS solar cell based on all printed layers

Manjeet Singh, Jinting Jiu, Tohru Sugahara, Katsuaki Suganuma

Session: Photovoltaic II

5th International Conference on Flexible and Printed Electronics (ICFPE 2014), Oct 21-23 2014 Beijing, China

Rapid photo-sintering techniques for printing devices

Jinting Jiu, Manjeet Singh, Teppei Araki, Tohru Sugahara, Masaya Nogi, Hirotaka Koga, Shijo Nagao, Katsuaki Suganuma, Hiroshi Uchida

Session: Sintering and drying process

5th International Conference on Flexible and Printed Electronics (ICFPE 2014), Oct 21-23 2014 Beijing, China

Flexible pressure sensor based on silver nanowire networks

Jun Wang, Jinting Jiu, Tohru Sugahara, Shijo Nagao, Masaya Nogi, Hirotaka Koga, Peng He, Katsuaki Suganuma

Session: Flexible Sensor I

5th International Conference on Flexible and Printed Electronics (ICFPE 2014), Oct 21-23 2014 Beijing, China

Zero Stress Die-Attach for Wide Band Gap Semiconductor Power Devices

K. Suganuma, J. Jinting, S. Koga, T. Sugahara, Semin Park, S. W. Park, C. M. Oh, and S. Nagao,

47th International Symposium on Microelectronics (IMAPS 2014), San Diego, USA, 2014.10.13-16.

SiC die-attch on DBA substrate with ceramic nano-particles added hybrid Ag particle paste

Hao Zhang, Shijo Nagao, Katsuaki Suganuma

Materials Science & Technology 2014

Pittsburgh, PA, USA, October 12 – 16, 2014

Pressureless Ag thin-film die-attach for SiC devices

C. Oh , S. Nagao, S. Koga , T. Sugahara,  K. Suganuma

European Conference of Silicon Carbide & Repated Materials (ECSCRM) 2014, Grenoble, France 21-25 Sept. 2014

Nanoscale Dynamic Mechanical Analysis on Heat-Resistant Silsesquioxane Nanocomposite for Power-Device Packaging

S. Nagao, N. Fujisawa , T. Sugioka, S. Ogawa, T.  Fujibayashi, T. Wada, T. Sugahara, K. Suganuma

European Conference of Silicon Carbide & Repated Materials (ECSCRM) 2014, Grenoble, France  21-25 Sept. 2014

Growth and characterization of molybdenum oxide nanorods by one-step sol-gel spin coating method

Shuren Cong, Tohru Sugahara, Jinting Jiu, Yukiko Hirose, Shijo Nagao, and Katsuaki Suganuma

第75回応用物理学会秋季学術講演会、2014年9月17日~20日、北海道大学、札幌

Nano-SiC added Ag paste sintering die-attach for SiC power devices

Hao Zhang, Shijo Nagao,  Sungwon Park, Shunsuke Koga, Tohru Sugahara, and Katsuaki Suganuma

5th Electronics System-Integration Technology Conference

Helsinki, Finland, September 16 – 18, 2014

Photoelectrical and microphysical properties of Sol-Gel derived IGZO thin films for printed TFTs

T. Matsuo, T. Sugahara, Y. Hirose, J. Jiu, S. Nagao, K. Suganuma, Jianying He, Zhiliang Zhang

ESTC 2014, Helsinki, Finland, September 16 – 18, 2014

ゾルゲル法によるIGZO均一膜の作製と安定剤の効果

松尾琢朗・菅原徹・廣瀬由紀子・酒金婷・長尾至成・菅沼克昭

日本セラミックス協会、第27回秋季シンポジウム、2014年

9月9日(火)~11日(木)鹿児島大学、鹿児島

SiC 粒子を添加した銀ペーストの焼結特性の改善

張昊、長尾至成、朴聖源、菅原徹、菅沼克昭

一般社団法人エレクトロニクス実装学会、秋季大会、第24回マイクロエレクトロニクスシンポジウム

9月4日(木)〜5日(金)、2014年、大阪大学、大阪

Sn-Zn鉛フリーはんだの電気化学腐食挙動

Jian-Chun Liu,長尾至成,朴聖源,菅原徹,Ju-Sheng Ma,Gong Zhang,菅沼克昭

[2C-3]信頼性技術

第24回マイクロエレクトロニクスシンポジウム秋季大会、Sep 4-5 2014 Osaka Univ, Japan

Agナノ粒子の合成条件と接合特性の検討

小賀俊輔、酒金婷、長尾至成、菅原徹、菅沼克昭

[2B-3]先端インターコネクト

第24回マイクロエレクトロニクスシンポジウム秋季大会、Sep 4-5 2014 Osaka Univ, Japan

Silver nanowire: synthesis, conductivity improvement and application to pressure sensor

Jun Wang, Teppei Araki, Jinting Jiu, Tohru Sugahara, Masaya Nogi, Shijo Nagao, Hirotaka Koga, Katsuaki Suganuma

Session: Nanomaterials: Synthesis and Characterization 14th International Conference on Nanotechnology (IEEE Nano 2014), Aug 18-21

2014 Toronto, Canada

High-Dielectric Paper Composite Consisting of Cellulose Nanofiber and Silver Nanowire

Tetsuji Inui, Hirotaka Koga, Masaya Nogi, Natsuki Komoda, Katsuaki Suganuma

14th International Conference on Nanotechnology (IEEE NANO 2014), Toronto, Canada, 2014.8.18-21

Ultrasonic bonding of Cu/Al clad ribbon interconnections in power electronic modules

Semin Park1, Shijo Nagao1, Tohru Sugahara1, Emi Yokoi1, Osami Iizuka2, and Katsuaki Suganuma1

1 The Institute of Scientific and Industrial Research, Osaka University, Japan

2 Semiconductor Equipment Group, Technoalpha Co., Ltd., Japan

67th IIW Annual Assembly & International Conference,Seoul, Korea, July 13-18, 2014

Electronics industries 2 (Joining processes)

Microimpact testing for miniaturized electronic component packaging

S. Nagao, Y.-S. Kim, T. Sugahara, Y. Onishi, and K. Suganuma, ISIR, Osaka University

20th European conference of fracture (ECF20), Trondheim, Norway | June 30- July 4

Conductivity improvement of silver nanowires film by thickness tailoring of polyvinylpyrrolidone nanolayer and application in flexible tactile sensor

Jun Wang, Jinting Jiu, Tohru Sugahara, Shijo Nagao, Masaya Nogi, Hirotaka Koga, Peng He, Katsuaki Suganuma Symposium

B2: Oxides Materials and Devices, Session

B2-1 International Union of Materials

Research Societies-International Conference on Electronic Materials 2014 (IUMRS-ICEM 2014), June 10-14 2014 Taipei, Taiwan

Low-pressure sintering bonding with Cu and CuO flake paste for power devices

S.W. Park1, R. Uwataki1, S. Nagao1, T. Sugahara1, Y. Katoh2, H.Ishino2, K. Sugiura2, K. Tsuruta2, and K. Suganuma1

1ISIR, Osaka University, 2Denso Corporation

The 64th IEEE Electronic Components and Technology Conference (ECTC2014), Lake Buena Vista, FL, USA| May 2014 27-30

Pressure-Less Plasma Sintering of Cu Paste for SiC Die-Attach of High-Temperature Power Device Manufacturing

S. Nagao1, K. Kodani2, S. Sakamoto1, S. W. Park1, T. Sugahara1, and K.Suganuma1

1ISIR, Osaka university, 2Nissin, Inc.

The 64th IEEE Electronic Components and Technology Conference (ECTC2014), Lake Buena Vista, FL, USA| May 2014 27-30

Synthesis and application of silver nanowires

J. Jiu1,T. Araki1, J. Wang1, M. Nogi1, T. Sugahara1, S. Nagao1, H. Koga1 , K. Suganuma1,

E. Nakazawa2, M. Hara2, H. Uchida2

1 ISIR, Osaka University, 2 Showa Denko K. K.

1st International Conference on Polyol Mediated Synthesis (IC-PMS), Paris, France | June 22-25

session: Nucleation and glowth

Partial transient liquid phase bonding for hightemperature power electronics using Sn/Zn/Sn sandwich structure solder

Sungwon Park1, Shijo Nagao1, Tohru Sugahara1, Yoshitaka Katoh2, Hiroshi Ishino2, Kazuhiko Sugiura2, Katsuaki Suganuma1

1ISIR, Osaka University, 2Denso Corporation

CIPS 2014 8th Meeting & Exhibition, Nuremberg, Germany | Feburary 25-27

session : Interconnects

High Temperature Compatibility of Interface between Al Ribbon and Au finished DBC Substrate

Semin Park, Shijo Nagao, Katsuaki Suganuma, ISIR, Osaka University

CIPS 2014 8th Meeting & Exhibition, Nuremberg, Germany | Feburary 25-27

session : Interfaces and Substrates

Microstructure Refinement in Sn-Ag-Bi-In Solder by Adding SiC Nanoparticles to Reduce Electromigration under High Electric Current

Youngseok Kim1, Shijo Nagao1, Tohru Sugahara1, Katsuaki Suganuma1, Minoru Ueshima2, Hans-Juergen Albrecht3, Klaus Wilke3, Joerg Stogies3

1ISIR, Osaka University, 2Senju Metal Industry Co. LTD, 3Siemens AG, Corporate Technology

TMS 2014 143rd Annual Meeting & Exhibition, San Diego, CA, USA | Feburary 16-20

session : Pb-free Solders and Emerging Interconnect and Packaging Materials – Electromigration and Flexible Packages

Pressure-less Si Wafer Bonding Using Sputtered Ag Thin Films

Chulmin Oh, Shijo Nagao, Katsuaki Suganuma, ISIR, Osaka University

TMS 2014 143rd Annual Meeting & Exhibition, San Diego, CA, USA | Feburary 16-20

session : Pb-free Solders and Emerging Interconnect and Packaging Materiasl – High Temperature Environment

Photo-Reduced Graphene Oxide/Cellulose Paper Electrode for Flexible Supercapacitor

Hidetsugu Tonomura, Hirotaka Koga, Yuta Nishina, Masaya Nogi, Katsuaki Suganuma
The 17th SANKEN International Symposium 2014(Osaka, Japan, 2014.1. 21-22)

To top