2018 Conference

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Influence of thermal exposure upon mechanical/electrical properties and
microstructure of sintered micro-porous silver

29th European symposium on reliability of electron devices, Failure physics and analysis (ESREF 2018), Aalborg, Denmark, October 1-5, 2018

Chanyang Choe, Seungjun Noh, Chuantong Chen, Dongjin Kim, Katsuaki Suganuma

Power cycle tests of high temperature Ag sinter die-attach on metalized ceramic substrate by using micro-heater SiC chip

51st International Symposium on Microelectronics (iMAPS2018), Pasadena, U.S.A, October 8-12, 2018

Dongjin Kim, Shijo Nagao, Naoki Wakasugi, Yasuyuki Yamamoto,  Aiji Suetake, Tetsu Takemasa and Katsuaki Suganuma

Large-area die-attachment by silver stress migration bonding for power device applications

29th European symposium on reliability of electron devices, Failure physics and analysis (ESREF 2018), Aalborg, Denmark, October 1-5, 2018

Seungjun Noh, Hao Zhang, Jeyun Yoem, Chuantong Chen, Caifu Li, and Katsuaki Suganuma

Packaging Material Technology for Wide Band Gap Power Devices and Its Performance/Reliability Evaluation

Americas International Meeting on Electrochemistry and Solid State Science (AiMES2018), Cancun, Mexico, September 30 to October 4, 2018

Katsuaki Suganuma (Invited lecture), Naoki Sato, Aishi Suetake, Chanyang Choe, Toru Sugahara, Shijo Nagao, Chuantong Chen

Thermal shock damage mechanism of GaN/DBA die-attach module with Ag sinter paste

2018 International Conference on Solid State Devices and Materials, Tokyo, Japan, September 9-13, 2018

Dongjin Kim, Chuantong Chen, Chun Pei, Zheng Zhang, Shijo Nagao, Aiji Suetake, Tohru Sugahara and Katsuaki Suganuma

Long-time stability of the stretchable wirings at different environment conditions

9th International Conference on Flexible and Printed Electronics 2018 (ICFPE 2018), Changzhou, China, September 25-28, 2018

Cai-Fu Li , Hao Zhang, Wanli Li, and Katusaki Suganuma

Thermal shock reliability of GaN die-attach on DBA with Ag sinter paste

The 19th International Conference on Electronic Packaging

Technology (ICEPT2018), Shanghai, China, August, 9-13, 2018

Dongjin Kim, Chuantong Chen, Chun Pei, Zheng Zhang, Shijo Nagao, Aiji Suetake, Tohru Sugahara and Katsuaki Suganuma

Thermostable porous Ag die-attach structure for high-temperature power devices

International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2018), College Park, USA, June 25-27, 2018

Seungjun Noh, Hao Zhang, and Katsuaki Suganuma

Nearly perfect Ag joints prepared by Ag stress-migration-bonding (SMB) process

International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2018), College Park, USA, June 25-27, 2018

Hao Zhang, Seungjun Noh, Norio Asatani, Yukiharu Kimoto, Shijo Nagao and Katsuaki Suganuma

Failure evaluation of GaN die-attach on DBC substrate by acoustic emission

14th International ceramics congress(CIMTEC 2018), Perugia, Italy, June 4-8, 2018

C. Y. Choe, S. J. Noh, C. Chen, S. Nagao and K. Suganuma

Large area bonding technology by using solid porous Ag in die-attached modules

14th International ceramics congress(CIMTEC 2018), Perugia, Italy, June 4-8, 2018

Chuantong Chen, Chanyang choe, Katsuaki Suganuma

Bonding technology using cold-rolled Ag sheet in die-attachment applications

International Power Electronics Conference (IPEC 2018), Niigata, Japan, May 20-24 (2018)

Seungjun Noh, Chanyang Choe, Chuantong Chen, Hao Zhang, and Katsuaki Suganuma

Stretchable wirings prepared with PU and silver flakes

The Minerals, Metals & Materials Society (TMS) 2018 Annual Meeting & Exhibition, Phoenix, Arizona, America, March 11-15, 2018

Cai-Fu Li, Hao Zhang, Wanli Li, Zhi-Quan Liu, Katsuaki Suganuma

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