2019 Conference

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Ag sintering with in-situ formation of nanoparticle: a sound Ag bonding technology for power electronics

The 20th International Symposium on Eco-Materials Processing and Design (ISEPD), Chungnam, Korea January 4-7, 2019

Jeyun Yeom, Cai-Fu Li, Katsuaki Suganuma

Improvement in bonding strength of Ag sinter joining on gold surface finished substrates by increasing the gold grain size

IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018: 22-25

Zhang Z, Chen C, Kurosaka S, et al.

カートリッジ方式熱流定常比較法による実装基板の熱特性評価および信頼性検証

第33回エレクトロニクス実装学会 春季講演大会、拓殖大学、2019年3月11〜13日
佐藤直樹、大串哲朗、若杉直樹、竹下一毅、陳伝トウ,長尾至成,菅沼克昭

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