2019 Conference

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Ag sintering with in-situ formation of nanoparticle: a sound Ag bonding technology for power electronics

The 20th International Symposium on Eco-Materials Processing and Design (ISEPD), Chungnam, Korea January 4-7, 2019

Jeyun Yeom, Cai-Fu Li, Katsuaki Suganuma

Improvement in bonding strength of Ag sinter joining on gold surface finished substrates by increasing the gold grain size

IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018: 22-25

Zhang Z, Chen C, Kurosaka S, et al.


第33回エレクトロニクス実装学会 春季講演大会、拓殖大学、2019年3月11〜13日

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