2019 Conference

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Alloying and Embedding of Cu-Core/Ag-Shell Nanowires for Ultra-Stable Stretchable and Transparent electrodes.

International Conference on Flexible and Printed Electronics (ICFPE 2019), Taipei, China, October 23-25, 2019.

Bowen Zhang, Chuantong Chen, Wanli Li, Katsuaki Suganuma.

Bonding and High-Temperature Storage Performance of Die Attachment with Ag Paste Sintering on Bare DBA Substrate

MES2019 (マ イクロエレクトロニクスシンポジウム), (Sep.2019) oral presentation.

Zhang, Z, Chen, C., Nagao, S., Suganuma, K.

Fabrication and characterization of nanomaterial-based sensor devices using solution printing method

nano M&D Symposium, June. 4(Tue.) – 8 (Sat.) 2019, PAESTUM, Italy

Bowen Zhang, Tohru Sugahara, Leila Alipour, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma

Fabrication of Oxide Nanostructure Gas Sensor Devises by a Simple Step MOD Method

GFMAT-2BIO-4-2019, July 19(Fri.) – 26 (Fri.) 2019, Toronto, Canadam, The 13th Pacific Rim Conference of Ceramic Societies (PACRIM13) October 27 – November 1, 2019, Okinawa Convention Center, Japan

Tohru Sugahara, Leila Alipour, Katsuaki Suganuma

Gas Sensors Fabrication with Nano-Structure Oxide Synthesized by Metal Organic Decomposition Method

JK-Ceramics 36 (2019) Nov. 20th (Wed.) – 23nd (Sat.) 2019, Tottri, Japan

Tohru SUGAHARA, Yukiko HIROSE, Katsuaki SUGANUMA

Fabrication of Oxide Nano-Structured Sensor Device for Low-Molecule Gas Sensor

MRS Fall meeting 2019, Dec. 1st (Sun.) – Dec. 5th (Fri.) 2019, Boston, USA

Tohru Sugahara, Leila Alipour, Yukiko Hirose, Jun-ichi Nakamura, Hironobu Ono, Nobuyuki Harada, Katsuaki Suganuma

Ag sintering with in-situ formation of nanoparticle: a sound Ag bonding technology for power electronics

The 20th International Symposium on Eco-Materials Processing and Design (ISEPD), Chungnam, Korea January 4-7, 2019

Jeyun Yeom, Cai-Fu Li, Katsuaki Suganuma

Microstructural and mechanical reliability of a GaN/DBA die-attached module with Ag sinter joining in harsh thermal environments

International Conference on Electronic Packaging Technology 2019 (ICEPT2019), Hong Kong, China (2019)

Dongjin Kim, Chuantong Chen, Shijo Nagao and Katsuaki Suganuma

GaN micro-heater chip for power cycling of die-attach modules with Ag sinter joint and high temperature solder

PCIM2018 Europe, Nuremberg, Germany (2019)

Dongjin Kim, Shijo Nagao, Chuantong Chen, Yasuyuki Yamamoto, Naoki Wakasugi, Yukiharu Kimoto, Tetsu Takemasa, Tohru Sugahara, and Katsuaki Suganuma

アルミ二ウム張りセラミック基板表面のNiスパッタリングによるGaNチップ銀焼結接合構造の冷熱衝撃耐性の向上

第29回 マイクロエレクトロニクスシンポジウム2019 (MES2019), Osaka, Japan (2019)

Dongjin Kim, Chuantong Chen, Shijo Nagao and Katsuaki Suganuma

Development of high-strength and superior thermal shock-resistant GaN/DBA die attach structure with Ag sinter joining by thick Ni metallization

European Symposium on Reliability of Electron Devices, Failure Physics and Analysis 2019 (ESREF 2019), Toulouse, France (2019)

Dongjin Kim, Chuantong Chen, Seungjun Noh, Seungjoon Lee, Zheng Zhang, Yukiharu Kimoto, and Katsuaki Suganuma

Improvement in bonding strength of Ag sinter joining on gold surface finished substrates by increasing the gold grain size

IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018: 22-25

Zhang Z, Chen C, Kurosaka S, et al.

カートリッジ方式熱流定常比較法による実装基板の熱特性評価および信頼性検証

第33回エレクトロニクス実装学会 春季講演大会、拓殖大学、2019年3月11〜13日
佐藤直樹、大串哲朗、若杉直樹、竹下一毅、陳伝トウ,長尾至成,菅沼克昭

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